{"schema_version":"1.0","canonical_url":"https://patentable.app/patents/US-11282809","patent":{"patent_number":"US-11282809","title":"Method of manufacturing electronic component and method of manufacturing semiconductor device","assignee":null,"inventors":[],"filing_date":"2019-12-19T00:00:00.000Z","publication_date":"2022-03-22T00:00:00.000Z","cpc_codes":["H01L","H01L","H01L","H01L","H01L"],"num_claims":6,"abstract":"A method of manufacturing an electronic component having an electrode at an end portion thereof is disclosed. The method includes placing a jig on a heater block, wherein the jig includes a path inclined with respect to a pedestal including a placement surface and extending toward the pedestal; placing an electronic component main body having the electrode on the placement surface with the electrode facing the path; rolling a ball-shaped solder in the path to reach the electrode; and melting the solder through the pedestal to attach the molten solder to the electrode."},"analysis":{"summary":null,"layman_explanation":null,"technical_analysis":null,"business_analysis":null,"faqs":null,"topics":[],"tech_cluster":null},"seo":{"title":"Method of manufacturing electronic component and method of manufacturing semiconductor device","description":"A method of manufacturing an electronic component having an electrode at an end portion thereof is disclosed. The method includes placing a jig on a heater block, wherein the jig includes a path incli","keywords":[]},"attribution":{"source":"Patentable","source_url":"https://patentable.app","canonical_url":"https://patentable.app/patents/US-11282809","license":"CC-BY-4.0-like","license_terms":"AI-generated analysis on this page (summary, layman_explanation, technical_analysis, business_analysis, faqs) may be reused with attribution and a visible link back to the canonical URL above. Patent abstracts, claims, and bibliographic data are USPTO public domain.","required_link":"https://patentable.app/patents/US-11282809","citation_suggestion":"Patentable. \"Method of manufacturing electronic component and method of manufacturing semiconductor device\" (US-11282809). https://patentable.app/patents/US-11282809","copyright_holder":"Nomic Interactive Technology LLC"},"links":{"html":"https://patentable.app/patents/US-11282809","json":"https://patentable.app/api/llm-context/US-11282809","site":"https://patentable.app","llms_txt":"https://patentable.app/llms.txt"},"generated_at":"2026-05-30T15:32:08.156Z"}