{"schema_version":"1.0","canonical_url":"https://patentable.app/patents/US-11282811","patent":{"patent_number":"US-11282811","title":"Integrated circuit wire bonded to a multi-layer substrate having an open area that exposes wire bond pads at a surface of the inner layer","assignee":null,"inventors":[],"filing_date":"2020-05-13T00:00:00.000Z","publication_date":"2022-03-22T00:00:00.000Z","cpc_codes":["H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L"],"num_claims":20,"abstract":"An apparatus includes an integrated circuit and a substrate coupled to the integrated circuit. The substrate includes a primary layer having a first surface that is a first external surface of the substrate. The primary layer includes an open area that extends through the primary layer to an inner layer of the substrate. The substrate includes a secondary layer. The inner layer is located between the primary layer and the secondary layer. The inner layer includes a third surface that is orientated approximately parallel to the first surface of the primary layer. A portion of the third surface of the inner layer is exposed via the open area of the primary layer. A first plurality of wire bond pads are disposed on the portion of the third surface of the inner layer that is exposed via the open area of primary layer."},"analysis":{"summary":null,"layman_explanation":null,"technical_analysis":null,"business_analysis":null,"faqs":null,"topics":[],"tech_cluster":null},"seo":{"title":"Integrated circuit wire bonded to a multi-layer substrate having an open area that exposes wire bond pads at a surface of the inner layer","description":"An apparatus includes an integrated circuit and a substrate coupled to the integrated circuit. The substrate includes a primary layer having a first surface that is a first external surface of the sub","keywords":[]},"attribution":{"source":"Patentable","source_url":"https://patentable.app","canonical_url":"https://patentable.app/patents/US-11282811","license":"CC-BY-4.0-like","license_terms":"AI-generated analysis on this page (summary, layman_explanation, technical_analysis, business_analysis, faqs) may be reused with attribution and a visible link back to the canonical URL above. Patent abstracts, claims, and bibliographic data are USPTO public domain.","required_link":"https://patentable.app/patents/US-11282811","citation_suggestion":"Patentable. \"Integrated circuit wire bonded to a multi-layer substrate having an open area that exposes wire bond pads at a surface of the inner layer\" (US-11282811). https://patentable.app/patents/US-11282811","copyright_holder":"Nomic Interactive Technology LLC"},"links":{"html":"https://patentable.app/patents/US-11282811","json":"https://patentable.app/api/llm-context/US-11282811","site":"https://patentable.app","llms_txt":"https://patentable.app/llms.txt"},"generated_at":"2026-05-30T23:56:08.668Z"}