{"schema_version":"1.0","canonical_url":"https://patentable.app/patents/US-11282814","patent":{"patent_number":"US-11282814","title":"Semiconductor device assemblies including stacked individual modules","assignee":null,"inventors":[],"filing_date":"2019-12-27T00:00:00.000Z","publication_date":"2022-03-22T00:00:00.000Z","cpc_codes":["H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L"],"num_claims":23,"abstract":"A semiconductor device assembly can include a substrate including a plurality of external connections. The assembly can include a first individual module and a first bond pad. The first individual module can be disposed on the substrate such that the first side of the first individual module faces the substrate. In some embodiments, the first individual module electrically is coupled to an external connection of the substrate via the first bond pad. The assembly can include a second individual module comprising a plurality of lateral sides. The second individual module can be disposed over the first individual module. In some embodiments, a first lateral side of the second individual module includes a first step forming a first overhang portion and a first recess. In some embodiments, the first bond pad is vertically aligned with the first recess of the second individual module."},"analysis":{"summary":null,"layman_explanation":null,"technical_analysis":null,"business_analysis":null,"faqs":null,"topics":[],"tech_cluster":null},"seo":{"title":"Semiconductor device assemblies including stacked individual modules","description":"A semiconductor device assembly can include a substrate including a plurality of external connections. The assembly can include a first individual module and a first bond pad. The first individual mod","keywords":[]},"attribution":{"source":"Patentable","source_url":"https://patentable.app","canonical_url":"https://patentable.app/patents/US-11282814","license":"CC-BY-4.0-like","license_terms":"AI-generated analysis on this page (summary, layman_explanation, technical_analysis, business_analysis, faqs) may be reused with attribution and a visible link back to the canonical URL above. Patent abstracts, claims, and bibliographic data are USPTO public domain.","required_link":"https://patentable.app/patents/US-11282814","citation_suggestion":"Patentable. \"Semiconductor device assemblies including stacked individual modules\" (US-11282814). https://patentable.app/patents/US-11282814","copyright_holder":"Nomic Interactive Technology LLC"},"links":{"html":"https://patentable.app/patents/US-11282814","json":"https://patentable.app/api/llm-context/US-11282814","site":"https://patentable.app","llms_txt":"https://patentable.app/llms.txt"},"generated_at":"2026-05-30T16:26:39.442Z"}