{"schema_version":"1.0","canonical_url":"https://patentable.app/patents/US-11282819","patent":{"patent_number":"US-11282819","title":"Semiconductor device having chip-to-chip bonding structure","assignee":null,"inventors":[],"filing_date":"2020-03-25T00:00:00.000Z","publication_date":"2022-03-22T00:00:00.000Z","cpc_codes":["H01L","G11C","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L"],"num_claims":10,"abstract":"A semiconductor device includes a first chip, divided into a plurality of regions, including a plurality of first pads and a plurality of first test pads in each of the plurality of regions; and a second chip including a plurality of second pads corresponding to the plurality of first pads and a plurality of second test pads corresponding to the plurality of first test pads, and bonded onto the first chip such that the plurality of second pads are coupled to the plurality of first pads. The second chip includes a voltage generation circuit linked to the plurality of second pads, that provides a compensated voltage to the plurality of second pads for each of the plurality of regions, based on a voltage drop value for each region due to a contact resistance between the plurality of first test pads and the plurality of second test pads."},"analysis":{"summary":null,"layman_explanation":null,"technical_analysis":null,"business_analysis":null,"faqs":null,"topics":[],"tech_cluster":null},"seo":{"title":"Semiconductor device having chip-to-chip bonding structure","description":"A semiconductor device includes a first chip, divided into a plurality of regions, including a plurality of first pads and a plurality of first test pads in each of the plurality of regions; and a sec","keywords":[]},"attribution":{"source":"Patentable","source_url":"https://patentable.app","canonical_url":"https://patentable.app/patents/US-11282819","license":"CC-BY-4.0-like","license_terms":"AI-generated analysis on this page (summary, layman_explanation, technical_analysis, business_analysis, faqs) may be reused with attribution and a visible link back to the canonical URL above. Patent abstracts, claims, and bibliographic data are USPTO public domain.","required_link":"https://patentable.app/patents/US-11282819","citation_suggestion":"Patentable. \"Semiconductor device having chip-to-chip bonding structure\" (US-11282819). https://patentable.app/patents/US-11282819","copyright_holder":"Nomic Interactive Technology LLC"},"links":{"html":"https://patentable.app/patents/US-11282819","json":"https://patentable.app/api/llm-context/US-11282819","site":"https://patentable.app","llms_txt":"https://patentable.app/llms.txt"},"generated_at":"2026-05-30T13:52:14.293Z"}