{"schema_version":"1.0","canonical_url":"https://patentable.app/patents/US-11284509","patent":{"patent_number":"US-11284509","title":"Method for forming flexible substrate including via, and flexible substrate having via","assignee":null,"inventors":[],"filing_date":"2020-12-16T00:00:00.000Z","publication_date":"2022-03-22T00:00:00.000Z","cpc_codes":["H01L","H01L","H01L","H01L"],"num_claims":5,"abstract":"Disclosed is a stretchable substrate including: a via configured to provide an electrical connection between one surface and the other surface of the stretchable substrate; and a buffer shell positioned between the via and the stretchable substrate and having a Young's modulus value that is greater than a Young's modulus value of the stretchable substrate and smaller than a Young's modulus value of the via."},"analysis":{"summary":null,"layman_explanation":null,"technical_analysis":null,"business_analysis":null,"faqs":null,"topics":[],"tech_cluster":null},"seo":{"title":"Method for forming flexible substrate including via, and flexible substrate having via","description":"Disclosed is a stretchable substrate including: a via configured to provide an electrical connection between one surface and the other surface of the stretchable substrate; and a buffer shell position","keywords":[]},"attribution":{"source":"Patentable","source_url":"https://patentable.app","canonical_url":"https://patentable.app/patents/US-11284509","license":"CC-BY-4.0-like","license_terms":"AI-generated analysis on this page (summary, layman_explanation, technical_analysis, business_analysis, faqs) may be reused with attribution and a visible link back to the canonical URL above. Patent abstracts, claims, and bibliographic data are USPTO public domain.","required_link":"https://patentable.app/patents/US-11284509","citation_suggestion":"Patentable. \"Method for forming flexible substrate including via, and flexible substrate having via\" (US-11284509). https://patentable.app/patents/US-11284509","copyright_holder":"Nomic Interactive Technology LLC"},"links":{"html":"https://patentable.app/patents/US-11284509","json":"https://patentable.app/api/llm-context/US-11284509","site":"https://patentable.app","llms_txt":"https://patentable.app/llms.txt"},"generated_at":"2026-05-31T18:39:27.444Z"}