{"schema_version":"1.0","canonical_url":"https://patentable.app/patents/US-11284515","patent":{"patent_number":"US-11284515","title":"Electronic component embedded substrate","assignee":null,"inventors":[],"filing_date":"2020-03-05T00:00:00.000Z","publication_date":"2022-03-22T00:00:00.000Z","cpc_codes":["H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L"],"num_claims":20,"abstract":"An electronic component-embedded substrate includes a first wiring layer, a first electronic component disposed on the first wiring layer, a first insulating material covering at least a portion of each of the first wiring layer and the first electronic component, a second wiring layer disposed on the first insulating material, a second electronic component disposed on the second wiring layer and connected to the first electronic component in an electrical parallel connection, a second insulating material disposed on the first insulating material and covering at least a portion of each of the second wiring layer and the second electronic component, and a first via penetrating through the first insulating material and connecting the first electronic component and the second wiring layer."},"analysis":{"summary":null,"layman_explanation":null,"technical_analysis":null,"business_analysis":null,"faqs":null,"topics":[],"tech_cluster":null},"seo":{"title":"Electronic component embedded substrate","description":"An electronic component-embedded substrate includes a first wiring layer, a first electronic component disposed on the first wiring layer, a first insulating material covering at least a portion of ea","keywords":[]},"attribution":{"source":"Patentable","source_url":"https://patentable.app","canonical_url":"https://patentable.app/patents/US-11284515","license":"CC-BY-4.0-like","license_terms":"AI-generated analysis on this page (summary, layman_explanation, technical_analysis, business_analysis, faqs) may be reused with attribution and a visible link back to the canonical URL above. Patent abstracts, claims, and bibliographic data are USPTO public domain.","required_link":"https://patentable.app/patents/US-11284515","citation_suggestion":"Patentable. \"Electronic component embedded substrate\" (US-11284515). https://patentable.app/patents/US-11284515","copyright_holder":"Nomic Interactive Technology LLC"},"links":{"html":"https://patentable.app/patents/US-11284515","json":"https://patentable.app/api/llm-context/US-11284515","site":"https://patentable.app","llms_txt":"https://patentable.app/llms.txt"},"generated_at":"2026-05-31T07:58:58.088Z"}