{"schema_version":"1.0","canonical_url":"https://patentable.app/patents/US-11285568","patent":{"patent_number":"US-11285568","title":"Solder preform for establishing a diffusion solder connection and method for producing a solder preform","assignee":null,"inventors":[],"filing_date":"2018-04-23T00:00:00.000Z","publication_date":"2022-03-29T00:00:00.000Z","cpc_codes":["H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L"],"num_claims":14,"abstract":"Various embodiments include a solder preform for establishing a diffusion solder connection comprising: a microstructure including a solder material and a metallic material; a first joining surface for a first joining partner and a second joining surface for a second joining partner; and a diffusion zone comprising an intermetallic compound of at least some of the solder material and at least some of the metallic material. The first joining surface and the second joining surface include at least some solder material."},"analysis":{"summary":null,"layman_explanation":null,"technical_analysis":null,"business_analysis":null,"faqs":null,"topics":[],"tech_cluster":null},"seo":{"title":"Solder preform for establishing a diffusion solder connection and method for producing a solder preform","description":"Various embodiments include a solder preform for establishing a diffusion solder connection comprising: a microstructure including a solder material and a metallic material; a first joining surface fo","keywords":[]},"attribution":{"source":"Patentable","source_url":"https://patentable.app","canonical_url":"https://patentable.app/patents/US-11285568","license":"CC-BY-4.0-like","license_terms":"AI-generated analysis on this page (summary, layman_explanation, technical_analysis, business_analysis, faqs) may be reused with attribution and a visible link back to the canonical URL above. Patent abstracts, claims, and bibliographic data are USPTO public domain.","required_link":"https://patentable.app/patents/US-11285568","citation_suggestion":"Patentable. \"Solder preform for establishing a diffusion solder connection and method for producing a solder preform\" (US-11285568). https://patentable.app/patents/US-11285568","copyright_holder":"Nomic Interactive Technology LLC"},"links":{"html":"https://patentable.app/patents/US-11285568","json":"https://patentable.app/api/llm-context/US-11285568","site":"https://patentable.app","llms_txt":"https://patentable.app/llms.txt"},"generated_at":"2026-05-31T07:59:10.500Z"}