{"schema_version":"1.0","canonical_url":"https://patentable.app/patents/US-11288437","patent":{"patent_number":"US-11288437","title":"Electromigration evaluation methodology with consideration of both self-heating and heat sink thermal effects","assignee":null,"inventors":[],"filing_date":"2020-12-14T00:00:00.000Z","publication_date":"2022-03-29T00:00:00.000Z","cpc_codes":["G06F","G06F","G06F","G06F"],"num_claims":20,"abstract":"An electromigration (EM) sign-off methodology that analyzes an integrated circuit design layout to identify heat sensitive structures, self-heating effects, heat generating structures, and heat dissipating structures. The EM sign-off methodology includes adjustments of an evaluation temperature for a heat sensitive structure by calculating the effects of self-heating within the temperature sensitive structure as well as additional heating and/or cooling as a function of thermal coupling to surrounding heat generating structures and/or heat sink elements located within a defined thermal coupling volume or range."},"analysis":{"summary":null,"layman_explanation":null,"technical_analysis":null,"business_analysis":null,"faqs":null,"topics":[],"tech_cluster":null},"seo":{"title":"Electromigration evaluation methodology with consideration of both self-heating and heat sink thermal effects","description":"An electromigration (EM) sign-off methodology that analyzes an integrated circuit design layout to identify heat sensitive structures, self-heating effects, heat generating structures, and heat dissip","keywords":[]},"attribution":{"source":"Patentable","source_url":"https://patentable.app","canonical_url":"https://patentable.app/patents/US-11288437","license":"CC-BY-4.0-like","license_terms":"AI-generated analysis on this page (summary, layman_explanation, technical_analysis, business_analysis, faqs) may be reused with attribution and a visible link back to the canonical URL above. Patent abstracts, claims, and bibliographic data are USPTO public domain.","required_link":"https://patentable.app/patents/US-11288437","citation_suggestion":"Patentable. \"Electromigration evaluation methodology with consideration of both self-heating and heat sink thermal effects\" (US-11288437). https://patentable.app/patents/US-11288437","copyright_holder":"Nomic Interactive Technology LLC"},"links":{"html":"https://patentable.app/patents/US-11288437","json":"https://patentable.app/api/llm-context/US-11288437","site":"https://patentable.app","llms_txt":"https://patentable.app/llms.txt"},"generated_at":"2026-05-30T15:39:40.961Z"}