{"schema_version":"1.0","canonical_url":"https://patentable.app/patents/US-11289395","patent":{"patent_number":"US-11289395","title":"Aperture structure on semiconductor component backside to alleviate delamination in stacked packaging","assignee":null,"inventors":[],"filing_date":"2020-03-17T00:00:00.000Z","publication_date":"2022-03-29T00:00:00.000Z","cpc_codes":["H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L"],"num_claims":8,"abstract":"A process includes forming one or more apertures on a component backside, creating a vacuum in a mold chase, and engaging the component backside with a mold compound in the mold chase. The one or more apertures form an aperture structure. The aperture structure may include multiple apertures parallel or orthogonal to each other. The apertures have an aperture width, aperture depth, and aperture pitch. These characteristics may be altered to minimize the likelihood of trapped air remaining after creating the vacuum in the mold chase."},"analysis":{"summary":null,"layman_explanation":null,"technical_analysis":null,"business_analysis":null,"faqs":null,"topics":[],"tech_cluster":null},"seo":{"title":"Aperture structure on semiconductor component backside to alleviate delamination in stacked packaging","description":"A process includes forming one or more apertures on a component backside, creating a vacuum in a mold chase, and engaging the component backside with a mold compound in the mold chase. The one or more","keywords":[]},"attribution":{"source":"Patentable","source_url":"https://patentable.app","canonical_url":"https://patentable.app/patents/US-11289395","license":"CC-BY-4.0-like","license_terms":"AI-generated analysis on this page (summary, layman_explanation, technical_analysis, business_analysis, faqs) may be reused with attribution and a visible link back to the canonical URL above. Patent abstracts, claims, and bibliographic data are USPTO public domain.","required_link":"https://patentable.app/patents/US-11289395","citation_suggestion":"Patentable. \"Aperture structure on semiconductor component backside to alleviate delamination in stacked packaging\" (US-11289395). https://patentable.app/patents/US-11289395","copyright_holder":"Nomic Interactive Technology LLC"},"links":{"html":"https://patentable.app/patents/US-11289395","json":"https://patentable.app/api/llm-context/US-11289395","site":"https://patentable.app","llms_txt":"https://patentable.app/llms.txt"},"generated_at":"2026-05-30T09:40:24.662Z"}