{"schema_version":"1.0","canonical_url":"https://patentable.app/patents/US-11289396","patent":{"patent_number":"US-11289396","title":"Sensing component encapsulated by an encapsulation layer with a roughness surface having a hollow region","assignee":null,"inventors":[],"filing_date":"2020-09-25T00:00:00.000Z","publication_date":"2022-03-29T00:00:00.000Z","cpc_codes":["H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L"],"num_claims":20,"abstract":"A semiconductor package includes a semiconductor die including a sensing component, an encapsulant extending along sidewalls of the semiconductor die, a through insulator via (TIV) and a dummy TIV penetrating through the encapsulant and disposed aside the semiconductor die, a patterned dielectric layer disposed on the encapsulant and exposing the sensing component of the semiconductor die, a conductive pattern disposed on the patterned dielectric layer and extending to be in contact with the TIV and the semiconductor die, and a first dummy conductive pattern disposed on the patterned dielectric layer and connected to the dummy TIV through an alignment opening of the first patterned dielectric layer. The semiconductor die is in a hollow region of the encapsulant, and a top width of the hollow region is greater than a width of the semiconductor die."},"analysis":{"summary":null,"layman_explanation":null,"technical_analysis":null,"business_analysis":null,"faqs":null,"topics":[],"tech_cluster":null},"seo":{"title":"Sensing component encapsulated by an encapsulation layer with a roughness surface having a hollow region","description":"A semiconductor package includes a semiconductor die including a sensing component, an encapsulant extending along sidewalls of the semiconductor die, a through insulator via (TIV) and a dummy TIV pen","keywords":[]},"attribution":{"source":"Patentable","source_url":"https://patentable.app","canonical_url":"https://patentable.app/patents/US-11289396","license":"CC-BY-4.0-like","license_terms":"AI-generated analysis on this page (summary, layman_explanation, technical_analysis, business_analysis, faqs) may be reused with attribution and a visible link back to the canonical URL above. Patent abstracts, claims, and bibliographic data are USPTO public domain.","required_link":"https://patentable.app/patents/US-11289396","citation_suggestion":"Patentable. \"Sensing component encapsulated by an encapsulation layer with a roughness surface having a hollow region\" (US-11289396). https://patentable.app/patents/US-11289396","copyright_holder":"Nomic Interactive Technology LLC"},"links":{"html":"https://patentable.app/patents/US-11289396","json":"https://patentable.app/api/llm-context/US-11289396","site":"https://patentable.app","llms_txt":"https://patentable.app/llms.txt"},"generated_at":"2026-05-30T17:06:48.419Z"}