{"schema_version":"1.0","canonical_url":"https://patentable.app/patents/US-11289401","patent":{"patent_number":"US-11289401","title":"Semiconductor package","assignee":null,"inventors":[],"filing_date":"2019-05-15T00:00:00.000Z","publication_date":"2022-03-29T00:00:00.000Z","cpc_codes":["H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L"],"num_claims":12,"abstract":"A semiconductor package and a manufacturing method thereof are provided. The semiconductor package includes a semiconductor die, an encapsulant, a redistribution layer, a polymer pattern and a heat dissipation structure. The semiconductor die has conductive pads at its active side, and is laterally encapsulated by the encapsulant. The redistribution layer is disposed at the active side of the semiconductor die, and spans over a front surface of the encapsulant. The redistribution layer is electrically connected with the conductive pads. The polymer pattern is disposed at a back surface of the encapsulant that is facing away from the front surface of the encapsulant. The semiconductor die is surrounded by the polymer pattern. The heat dissipation structure is in contact with a back side of the semiconductor die that is facing away from the active side, and extends onto the polymer pattern."},"analysis":{"summary":null,"layman_explanation":null,"technical_analysis":null,"business_analysis":null,"faqs":null,"topics":[],"tech_cluster":null},"seo":{"title":"Semiconductor package","description":"A semiconductor package and a manufacturing method thereof are provided. The semiconductor package includes a semiconductor die, an encapsulant, a redistribution layer, a polymer pattern and a heat di","keywords":[]},"attribution":{"source":"Patentable","source_url":"https://patentable.app","canonical_url":"https://patentable.app/patents/US-11289401","license":"CC-BY-4.0-like","license_terms":"AI-generated analysis on this page (summary, layman_explanation, technical_analysis, business_analysis, faqs) may be reused with attribution and a visible link back to the canonical URL above. Patent abstracts, claims, and bibliographic data are USPTO public domain.","required_link":"https://patentable.app/patents/US-11289401","citation_suggestion":"Patentable. \"Semiconductor package\" (US-11289401). https://patentable.app/patents/US-11289401","copyright_holder":"Nomic Interactive Technology LLC"},"links":{"html":"https://patentable.app/patents/US-11289401","json":"https://patentable.app/api/llm-context/US-11289401","site":"https://patentable.app","llms_txt":"https://patentable.app/llms.txt"},"generated_at":"2026-05-30T19:46:58.344Z"}