{"schema_version":"1.0","canonical_url":"https://patentable.app/patents/US-11289418","patent":{"patent_number":"US-11289418","title":"Package structure and manufacturing method thereof","assignee":null,"inventors":[],"filing_date":"2020-05-24T00:00:00.000Z","publication_date":"2022-03-29T00:00:00.000Z","cpc_codes":["H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L"],"num_claims":20,"abstract":"A package structure includes a redistribution circuit structure, at least one semiconductor die, an insulating encapsulation, insulators, and metallic patterns. The at least one semiconductor die is located on and electrically connected to the redistribution circuit structure. The insulating encapsulation encapsulates the at least one semiconductor die and located on the redistribution circuit structure. The insulators are located on the redistribution circuit structure, wherein the insulators are separated and spaced apart from each other, wherein edges of each of the insulators are distant from edges of the at least one semiconductor die by an offset in a stacking direction of the redistribution circuit structure and the insulating encapsulation. Each of the metallic patterns is located on a respective one of the insulators."},"analysis":{"summary":null,"layman_explanation":null,"technical_analysis":null,"business_analysis":null,"faqs":null,"topics":[],"tech_cluster":null},"seo":{"title":"Package structure and manufacturing method thereof","description":"A package structure includes a redistribution circuit structure, at least one semiconductor die, an insulating encapsulation, insulators, and metallic patterns. The at least one semiconductor die is l","keywords":[]},"attribution":{"source":"Patentable","source_url":"https://patentable.app","canonical_url":"https://patentable.app/patents/US-11289418","license":"CC-BY-4.0-like","license_terms":"AI-generated analysis on this page (summary, layman_explanation, technical_analysis, business_analysis, faqs) may be reused with attribution and a visible link back to the canonical URL above. Patent abstracts, claims, and bibliographic data are USPTO public domain.","required_link":"https://patentable.app/patents/US-11289418","citation_suggestion":"Patentable. \"Package structure and manufacturing method thereof\" (US-11289418). https://patentable.app/patents/US-11289418","copyright_holder":"Nomic Interactive Technology LLC"},"links":{"html":"https://patentable.app/patents/US-11289418","json":"https://patentable.app/api/llm-context/US-11289418","site":"https://patentable.app","llms_txt":"https://patentable.app/llms.txt"},"generated_at":"2026-05-30T16:37:56.980Z"}