{"schema_version":"1.0","canonical_url":"https://patentable.app/patents/US-11289427","patent":{"patent_number":"US-11289427","title":"Multi-faceted integrated-circuit dice and packages","assignee":null,"inventors":[],"filing_date":"2020-03-13T00:00:00.000Z","publication_date":"2022-03-29T00:00:00.000Z","cpc_codes":["H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L"],"num_claims":7,"abstract":"A faceted integrated-circuit die includes a concave facet with an increased interconnect breakout area available to an adjacent device such as a rectangular IC die that is nested within the form factor of the concave facet. The concave facet form factor includes a ledge facet and a main-die facet. Multiple nested faceted IC dice are disclosed for increasing interconnect breakout areas and package miniaturization. A faceted silicon interposer has a concave facet that also provides an increased interconnect breakout area and package miniaturization."},"analysis":{"summary":null,"layman_explanation":null,"technical_analysis":null,"business_analysis":null,"faqs":null,"topics":[],"tech_cluster":null},"seo":{"title":"Multi-faceted integrated-circuit dice and packages","description":"A faceted integrated-circuit die includes a concave facet with an increased interconnect breakout area available to an adjacent device such as a rectangular IC die that is nested within the form facto","keywords":[]},"attribution":{"source":"Patentable","source_url":"https://patentable.app","canonical_url":"https://patentable.app/patents/US-11289427","license":"CC-BY-4.0-like","license_terms":"AI-generated analysis on this page (summary, layman_explanation, technical_analysis, business_analysis, faqs) may be reused with attribution and a visible link back to the canonical URL above. Patent abstracts, claims, and bibliographic data are USPTO public domain.","required_link":"https://patentable.app/patents/US-11289427","citation_suggestion":"Patentable. \"Multi-faceted integrated-circuit dice and packages\" (US-11289427). https://patentable.app/patents/US-11289427","copyright_holder":"Nomic Interactive Technology LLC"},"links":{"html":"https://patentable.app/patents/US-11289427","json":"https://patentable.app/api/llm-context/US-11289427","site":"https://patentable.app","llms_txt":"https://patentable.app/llms.txt"},"generated_at":"2026-05-31T12:36:40.885Z"}