{"schema_version":"1.0","canonical_url":"https://patentable.app/patents/US-11289449","patent":{"patent_number":"US-11289449","title":"Packaging methods for semiconductor devices, packaged semiconductor devices, and design methods thereof","assignee":null,"inventors":[],"filing_date":"2019-09-12T00:00:00.000Z","publication_date":"2022-03-29T00:00:00.000Z","cpc_codes":["H01L","G06F","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L"],"num_claims":20,"abstract":"Packaging methods for semiconductor devices, packaged semiconductor devices, and design methods thereof are disclosed. In some embodiments, a method of packaging a plurality of semiconductor devices includes providing a first die, and coupling second dies to the first die. An electrical connection is formed between the first die and each of the second dies. A portion of each of the electrical connections is disposed between the second dies."},"analysis":{"summary":null,"layman_explanation":null,"technical_analysis":null,"business_analysis":null,"faqs":null,"topics":[],"tech_cluster":null},"seo":{"title":"Packaging methods for semiconductor devices, packaged semiconductor devices, and design methods thereof","description":"Packaging methods for semiconductor devices, packaged semiconductor devices, and design methods thereof are disclosed. In some embodiments, a method of packaging a plurality of semiconductor devices i","keywords":[]},"attribution":{"source":"Patentable","source_url":"https://patentable.app","canonical_url":"https://patentable.app/patents/US-11289449","license":"CC-BY-4.0-like","license_terms":"AI-generated analysis on this page (summary, layman_explanation, technical_analysis, business_analysis, faqs) may be reused with attribution and a visible link back to the canonical URL above. Patent abstracts, claims, and bibliographic data are USPTO public domain.","required_link":"https://patentable.app/patents/US-11289449","citation_suggestion":"Patentable. \"Packaging methods for semiconductor devices, packaged semiconductor devices, and design methods thereof\" (US-11289449). https://patentable.app/patents/US-11289449","copyright_holder":"Nomic Interactive Technology LLC"},"links":{"html":"https://patentable.app/patents/US-11289449","json":"https://patentable.app/api/llm-context/US-11289449","site":"https://patentable.app","llms_txt":"https://patentable.app/llms.txt"},"generated_at":"2026-05-30T14:27:24.260Z"}