{"schema_version":"1.0","canonical_url":"https://patentable.app/patents/US-11289454","patent":{"patent_number":"US-11289454","title":"Semiconductor package including dam structure surrounding semiconductor chip and method of manufacturing the same","assignee":null,"inventors":[],"filing_date":"2020-05-28T00:00:00.000Z","publication_date":"2022-03-29T00:00:00.000Z","cpc_codes":["H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L"],"num_claims":20,"abstract":"A semiconductor package includes a base substrate, a first semiconductor chip on the base substrate, a dam structure on the base substrate and surrounding the first semiconductor chip, a second semiconductor chip on the first semiconductor chip, a non-conductive film, and a molding member. The non-conductive film may be between the base substrate, the first semiconductor chip, and the second semiconductor chip. The molding member may cover the base substrate, the first semiconductor chip, and the second semiconductor chip. A level of an upper surface of the first semiconductor chip and a level of an upper surface of the dam structure may be at a same level."},"analysis":{"summary":null,"layman_explanation":null,"technical_analysis":null,"business_analysis":null,"faqs":null,"topics":[],"tech_cluster":null},"seo":{"title":"Semiconductor package including dam structure surrounding semiconductor chip and method of manufacturing the same","description":"A semiconductor package includes a base substrate, a first semiconductor chip on the base substrate, a dam structure on the base substrate and surrounding the first semiconductor chip, a second semico","keywords":[]},"attribution":{"source":"Patentable","source_url":"https://patentable.app","canonical_url":"https://patentable.app/patents/US-11289454","license":"CC-BY-4.0-like","license_terms":"AI-generated analysis on this page (summary, layman_explanation, technical_analysis, business_analysis, faqs) may be reused with attribution and a visible link back to the canonical URL above. Patent abstracts, claims, and bibliographic data are USPTO public domain.","required_link":"https://patentable.app/patents/US-11289454","citation_suggestion":"Patentable. \"Semiconductor package including dam structure surrounding semiconductor chip and method of manufacturing the same\" (US-11289454). https://patentable.app/patents/US-11289454","copyright_holder":"Nomic Interactive Technology LLC"},"links":{"html":"https://patentable.app/patents/US-11289454","json":"https://patentable.app/api/llm-context/US-11289454","site":"https://patentable.app","llms_txt":"https://patentable.app/llms.txt"},"generated_at":"2026-05-31T05:11:29.253Z"}