{"schema_version":"1.0","canonical_url":"https://patentable.app/patents/US-11289459","patent":{"patent_number":"US-11289459","title":"Apparatus and method for manufacturing light-emitting diode module","assignee":null,"inventors":[],"filing_date":"2018-05-30T00:00:00.000Z","publication_date":"2022-03-29T00:00:00.000Z","cpc_codes":["H01L","H01L"],"num_claims":20,"abstract":"The present invention relates to an apparatus and a method for manufacturing a light-emitting diode (LED) module and, more particularly, to an apparatus and a method for manufacturing a light-emitting diode module, which are capable of manufacturing a light emitting diode module on which a plurality of light-emitting diodes are mounted with an improved bonding speed and high accuracy by manufacturing the light-emitting diode module by simultaneously transferring the plurality of light emitting diodes onto a substrate by using a multi-eject pin or a multi-collet. An apparatus for manufacturing a light-emitting diode (LED) module according to one embodiment of the present invention, in which the light-emitting diode module comprises a plurality of light-emitting diodes each having one side surface with an exposed electrode surface and the other side surface corresponding to the one side surface, comprises: a sheet placement unit in which a sheet having a lower portion to which the other side surfaces of the plurality of light-emitting diodes are adhered is placed; a substrate placement unit in which a substrate is placed at a position corresponding to the sheet in the lower portion of the sheet, wherein the substrate has thereon a conductive pattern to which the one side surfaces of the plurality of light-emitting diodes are electrically contacted; and a multi-transfer unit having, on a higher portion of the sheet, a plurality of eject pins for transferring the plurality of light-emitting diodes adhered to the lower portion of the sheet onto the substrate, wherein the multi-transfer unit is characterized in that the plurality of eject pins transfer the plurality of light-emitting diodes onto the substrate."},"analysis":{"summary":null,"layman_explanation":null,"technical_analysis":null,"business_analysis":null,"faqs":null,"topics":[],"tech_cluster":null},"seo":{"title":"Apparatus and method for manufacturing light-emitting diode module","description":"The present invention relates to an apparatus and a method for manufacturing a light-emitting diode (LED) module and, more particularly, to an apparatus and a method for manufacturing a light-emitting","keywords":[]},"attribution":{"source":"Patentable","source_url":"https://patentable.app","canonical_url":"https://patentable.app/patents/US-11289459","license":"CC-BY-4.0-like","license_terms":"AI-generated analysis on this page (summary, layman_explanation, technical_analysis, business_analysis, faqs) may be reused with attribution and a visible link back to the canonical URL above. Patent abstracts, claims, and bibliographic data are USPTO public domain.","required_link":"https://patentable.app/patents/US-11289459","citation_suggestion":"Patentable. \"Apparatus and method for manufacturing light-emitting diode module\" (US-11289459). https://patentable.app/patents/US-11289459","copyright_holder":"Nomic Interactive Technology LLC"},"links":{"html":"https://patentable.app/patents/US-11289459","json":"https://patentable.app/api/llm-context/US-11289459","site":"https://patentable.app","llms_txt":"https://patentable.app/llms.txt"},"generated_at":"2026-05-30T14:27:48.927Z"}