{"schema_version":"1.0","canonical_url":"https://patentable.app/patents/US-11289521","patent":{"patent_number":"US-11289521","title":"Camera module and molded photosensitive assembly and manufacturing method therefor, and electronic device","assignee":null,"inventors":[],"filing_date":"2016-10-25T00:00:00.000Z","publication_date":"2022-03-29T00:00:00.000Z","cpc_codes":["H01L","H01L","H04N","H04N","H01L","H01L","H01L","H01L","H01L"],"num_claims":20,"abstract":"A molded photosensitive assembly of a camera module includes at least one supporting member formed by a first substance, at least one photosensitive element, at least one circuit board, at least one set of wires electrically connecting the photosensitive element to the circuit board, and at least one molded base. Two ends of each of the wires are respectively connected to a chip connector of the photosensitive element and a circuit connector of the circuit board. The molded base is formed by a second substance and comprises a molded body and has at least one light window, wherein the photosensitive element and the wires are protected by a supporting member which is provided for avoiding an upper mold of a molding-die pressing on the wires during the molding process."},"analysis":{"summary":null,"layman_explanation":null,"technical_analysis":null,"business_analysis":null,"faqs":null,"topics":[],"tech_cluster":null},"seo":{"title":"Camera module and molded photosensitive assembly and manufacturing method therefor, and electronic device","description":"A molded photosensitive assembly of a camera module includes at least one supporting member formed by a first substance, at least one photosensitive element, at least one circuit board, at least one s","keywords":[]},"attribution":{"source":"Patentable","source_url":"https://patentable.app","canonical_url":"https://patentable.app/patents/US-11289521","license":"CC-BY-4.0-like","license_terms":"AI-generated analysis on this page (summary, layman_explanation, technical_analysis, business_analysis, faqs) may be reused with attribution and a visible link back to the canonical URL above. Patent abstracts, claims, and bibliographic data are USPTO public domain.","required_link":"https://patentable.app/patents/US-11289521","citation_suggestion":"Patentable. \"Camera module and molded photosensitive assembly and manufacturing method therefor, and electronic device\" (US-11289521). https://patentable.app/patents/US-11289521","copyright_holder":"Nomic Interactive Technology LLC"},"links":{"html":"https://patentable.app/patents/US-11289521","json":"https://patentable.app/api/llm-context/US-11289521","site":"https://patentable.app","llms_txt":"https://patentable.app/llms.txt"},"generated_at":"2026-05-31T00:39:30.235Z"}