{"schema_version":"1.0","canonical_url":"https://patentable.app/patents/US-11289633","patent":{"patent_number":"US-11289633","title":"LED array package and manufacturing method thereof","assignee":null,"inventors":[],"filing_date":"2019-11-20T00:00:00.000Z","publication_date":"2022-03-29T00:00:00.000Z","cpc_codes":["H01L"],"num_claims":15,"abstract":"The present invention relates to a micro Light Emitting Diode (LED) matrix array package, including: a plurality of light emitting devices including a base substrate and a semiconductor laminated layer formed on the base substrate; a plurality of solder balls formed on the semiconductor laminated layer of the plurality of light emitting devices, respectively; a molding member configured to surround the light emitting devices and the solder balls; and a circuit board formed on the molding member, in which upper surfaces of the solder balls are exposed from the molding member, the circuit board includes a contact layer consisted of a metal pattern layer electrically connected with the plurality of solder balls exposed from the molding member and an insulating layer adjacently disposed to the metal pattern layer, and a thickness from the base substrate of each of the plurality of light emitting devices to an upper surface of each of the exposed solder balls is the same each other."},"analysis":{"summary":null,"layman_explanation":null,"technical_analysis":null,"business_analysis":null,"faqs":null,"topics":[],"tech_cluster":null},"seo":{"title":"LED array package and manufacturing method thereof","description":"The present invention relates to a micro Light Emitting Diode (LED) matrix array package, including: a plurality of light emitting devices including a base substrate and a semiconductor laminated laye","keywords":[]},"attribution":{"source":"Patentable","source_url":"https://patentable.app","canonical_url":"https://patentable.app/patents/US-11289633","license":"CC-BY-4.0-like","license_terms":"AI-generated analysis on this page (summary, layman_explanation, technical_analysis, business_analysis, faqs) may be reused with attribution and a visible link back to the canonical URL above. Patent abstracts, claims, and bibliographic data are USPTO public domain.","required_link":"https://patentable.app/patents/US-11289633","citation_suggestion":"Patentable. \"LED array package and manufacturing method thereof\" (US-11289633). https://patentable.app/patents/US-11289633","copyright_holder":"Nomic Interactive Technology LLC"},"links":{"html":"https://patentable.app/patents/US-11289633","json":"https://patentable.app/api/llm-context/US-11289633","site":"https://patentable.app","llms_txt":"https://patentable.app/llms.txt"},"generated_at":"2026-05-30T21:21:15.751Z"}