{"schema_version":"1.0","canonical_url":"https://patentable.app/patents/US-11289793","patent":{"patent_number":"US-11289793","title":"Semiconductor packaging structure having antenna module","assignee":null,"inventors":[],"filing_date":"2018-12-05T00:00:00.000Z","publication_date":"2022-03-29T00:00:00.000Z","cpc_codes":["H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L"],"num_claims":11,"abstract":"The present disclosure provides a semiconductor packaging structure having an antenna module, comprising: a substrate having a first surface and a second surface opposite to the first surface; a redistribution layer located on the first surface of the substrate; a metal bump located on one side, insulated from the substrate, of the redistribution layer, and electrically connected with the redistribution layer; a semiconductor chip disposed on a surface, insulated from the substrate, of the redistribution layer, and electrically connected with the redistribution layer, a space is configured between the semiconductor chip and the metal bump; and an antenna module located on the second surface of the substrate."},"analysis":{"summary":null,"layman_explanation":null,"technical_analysis":null,"business_analysis":null,"faqs":null,"topics":[],"tech_cluster":null},"seo":{"title":"Semiconductor packaging structure having antenna module","description":"The present disclosure provides a semiconductor packaging structure having an antenna module, comprising: a substrate having a first surface and a second surface opposite to the first surface; a redis","keywords":[]},"attribution":{"source":"Patentable","source_url":"https://patentable.app","canonical_url":"https://patentable.app/patents/US-11289793","license":"CC-BY-4.0-like","license_terms":"AI-generated analysis on this page (summary, layman_explanation, technical_analysis, business_analysis, faqs) may be reused with attribution and a visible link back to the canonical URL above. Patent abstracts, claims, and bibliographic data are USPTO public domain.","required_link":"https://patentable.app/patents/US-11289793","citation_suggestion":"Patentable. \"Semiconductor packaging structure having antenna module\" (US-11289793). https://patentable.app/patents/US-11289793","copyright_holder":"Nomic Interactive Technology LLC"},"links":{"html":"https://patentable.app/patents/US-11289793","json":"https://patentable.app/api/llm-context/US-11289793","site":"https://patentable.app","llms_txt":"https://patentable.app/llms.txt"},"generated_at":"2026-05-31T15:48:27.245Z"}