{"schema_version":"1.0","canonical_url":"https://patentable.app/patents/US-11295949","patent":{"patent_number":"US-11295949","title":"Virtual wafer techniques for fabricating semiconductor devices","assignee":null,"inventors":[],"filing_date":"2019-04-01T00:00:00.000Z","publication_date":"2022-04-05T00:00:00.000Z","cpc_codes":["H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L"],"num_claims":18,"abstract":"A method of fabricating semiconductor devices including epitaxially depositing a heavily doped substrate layer that is substantially free of crystalline defects on a lightly doped virtual substrate. The device regions of the semiconductor devices can be fabricated about the heavily doped substrate layer before the lightly doped virtual substrate is removed."},"analysis":{"summary":null,"layman_explanation":null,"technical_analysis":null,"business_analysis":null,"faqs":null,"topics":[],"tech_cluster":null},"seo":{"title":"Virtual wafer techniques for fabricating semiconductor devices","description":"A method of fabricating semiconductor devices including epitaxially depositing a heavily doped substrate layer that is substantially free of crystalline defects on a lightly doped virtual substrate. T","keywords":[]},"attribution":{"source":"Patentable","source_url":"https://patentable.app","canonical_url":"https://patentable.app/patents/US-11295949","license":"CC-BY-4.0-like","license_terms":"AI-generated analysis on this page (summary, layman_explanation, technical_analysis, business_analysis, faqs) may be reused with attribution and a visible link back to the canonical URL above. Patent abstracts, claims, and bibliographic data are USPTO public domain.","required_link":"https://patentable.app/patents/US-11295949","citation_suggestion":"Patentable. \"Virtual wafer techniques for fabricating semiconductor devices\" (US-11295949). https://patentable.app/patents/US-11295949","copyright_holder":"Nomic Interactive Technology LLC"},"links":{"html":"https://patentable.app/patents/US-11295949","json":"https://patentable.app/api/llm-context/US-11295949","site":"https://patentable.app","llms_txt":"https://patentable.app/llms.txt"},"generated_at":"2026-05-30T20:59:39.936Z"}