{"schema_version":"1.0","canonical_url":"https://patentable.app/patents/US-11295978","patent":{"patent_number":"US-11295978","title":"Interconnects having spacers for improved top via critical dimension and overlay tolerance","assignee":null,"inventors":[],"filing_date":"2020-04-29T00:00:00.000Z","publication_date":"2022-04-05T00:00:00.000Z","cpc_codes":["H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L"],"num_claims":6,"abstract":"A method of fabricating an integrated circuit includes forming a first trench such that a portion of the first trench is defined by a portion of a first-type of interconnect and depositing a sacrificial spacer liner in the first trench to cover the portion of the first-type of interconnect element. The method further includes forming a dielectric cap on the sacrificial spacer liner and above the first-type of interconnect element, removing the dielectric cap to expose at least a portion of the first-type of interconnect element, and forming a second-type of interconnect element on the exposed first-type of interconnect element."},"analysis":{"summary":null,"layman_explanation":null,"technical_analysis":null,"business_analysis":null,"faqs":null,"topics":[],"tech_cluster":null},"seo":{"title":"Interconnects having spacers for improved top via critical dimension and overlay tolerance","description":"A method of fabricating an integrated circuit includes forming a first trench such that a portion of the first trench is defined by a portion of a first-type of interconnect and depositing a sacrifici","keywords":[]},"attribution":{"source":"Patentable","source_url":"https://patentable.app","canonical_url":"https://patentable.app/patents/US-11295978","license":"CC-BY-4.0-like","license_terms":"AI-generated analysis on this page (summary, layman_explanation, technical_analysis, business_analysis, faqs) may be reused with attribution and a visible link back to the canonical URL above. Patent abstracts, claims, and bibliographic data are USPTO public domain.","required_link":"https://patentable.app/patents/US-11295978","citation_suggestion":"Patentable. \"Interconnects having spacers for improved top via critical dimension and overlay tolerance\" (US-11295978). https://patentable.app/patents/US-11295978","copyright_holder":"Nomic Interactive Technology LLC"},"links":{"html":"https://patentable.app/patents/US-11295978","json":"https://patentable.app/api/llm-context/US-11295978","site":"https://patentable.app","llms_txt":"https://patentable.app/llms.txt"},"generated_at":"2026-05-31T03:59:43.850Z"}