{"schema_version":"1.0","canonical_url":"https://patentable.app/patents/US-11295982","patent":{"patent_number":"US-11295982","title":"Forming ultra-thin chips for flexible electronics applications","assignee":null,"inventors":[],"filing_date":"2019-06-11T00:00:00.000Z","publication_date":"2022-04-05T00:00:00.000Z","cpc_codes":["H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L"],"num_claims":9,"abstract":"A method of fabricating ultra-thin chips is provided. The method includes patterning circuit elements onto a substrate such that sections of the substrate are exposed and etching trenches into the sections of the substrate to define pedestals respectively associated with a corresponding circuit element. The method further includes depositing stressor layer material onto the circuit elements and applying handling tape to the stressor layer material. In addition, the method includes at least one of weakening the substrate in a plane defined by base corners of the pedestals and initiating substrate cracking at the base corners of the pedestals to encourage spalling of the pedestals off the substrate."},"analysis":{"summary":null,"layman_explanation":null,"technical_analysis":null,"business_analysis":null,"faqs":null,"topics":[],"tech_cluster":null},"seo":{"title":"Forming ultra-thin chips for flexible electronics applications","description":"A method of fabricating ultra-thin chips is provided. The method includes patterning circuit elements onto a substrate such that sections of the substrate are exposed and etching trenches into the sec","keywords":[]},"attribution":{"source":"Patentable","source_url":"https://patentable.app","canonical_url":"https://patentable.app/patents/US-11295982","license":"CC-BY-4.0-like","license_terms":"AI-generated analysis on this page (summary, layman_explanation, technical_analysis, business_analysis, faqs) may be reused with attribution and a visible link back to the canonical URL above. Patent abstracts, claims, and bibliographic data are USPTO public domain.","required_link":"https://patentable.app/patents/US-11295982","citation_suggestion":"Patentable. \"Forming ultra-thin chips for flexible electronics applications\" (US-11295982). https://patentable.app/patents/US-11295982","copyright_holder":"Nomic Interactive Technology LLC"},"links":{"html":"https://patentable.app/patents/US-11295982","json":"https://patentable.app/api/llm-context/US-11295982","site":"https://patentable.app","llms_txt":"https://patentable.app/llms.txt"},"generated_at":"2026-05-30T15:37:32.058Z"}