{"schema_version":"1.0","canonical_url":"https://patentable.app/patents/US-11295997","patent":{"patent_number":"US-11295997","title":"Semiconductor device manufacturing method and semiconductor device","assignee":null,"inventors":[],"filing_date":"2020-05-26T00:00:00.000Z","publication_date":"2022-04-05T00:00:00.000Z","cpc_codes":["H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L"],"num_claims":16,"abstract":"A method of manufacturing a semiconductor device prepares contact members, each of which has a cylindrical through-hole, and column-shaped connection terminals, each having a polygonal shape in a cross-sectional view along a length direction thereof, wherein a length of a diagonal of the polygonal shape is greater than an inner diameter of the through-holes. Chamfers with a curvature for fitting an inner surface of the through-holes are formed at corners of the connection terminal, and the connection terminals are press-fitted into the through-holes of the contacts. By doing so, the area of contact where the connection terminals press-fitted into the contacts contact the inner circumferential surfaces of the through-holes of the contacts is increased. This increases the tensile load of the connection terminals fitted into the contacts."},"analysis":{"summary":null,"layman_explanation":null,"technical_analysis":null,"business_analysis":null,"faqs":null,"topics":[],"tech_cluster":null},"seo":{"title":"Semiconductor device manufacturing method and semiconductor device","description":"A method of manufacturing a semiconductor device prepares contact members, each of which has a cylindrical through-hole, and column-shaped connection terminals, each having a polygonal shape in a cros","keywords":[]},"attribution":{"source":"Patentable","source_url":"https://patentable.app","canonical_url":"https://patentable.app/patents/US-11295997","license":"CC-BY-4.0-like","license_terms":"AI-generated analysis on this page (summary, layman_explanation, technical_analysis, business_analysis, faqs) may be reused with attribution and a visible link back to the canonical URL above. Patent abstracts, claims, and bibliographic data are USPTO public domain.","required_link":"https://patentable.app/patents/US-11295997","citation_suggestion":"Patentable. \"Semiconductor device manufacturing method and semiconductor device\" (US-11295997). https://patentable.app/patents/US-11295997","copyright_holder":"Nomic Interactive Technology LLC"},"links":{"html":"https://patentable.app/patents/US-11295997","json":"https://patentable.app/api/llm-context/US-11295997","site":"https://patentable.app","llms_txt":"https://patentable.app/llms.txt"},"generated_at":"2026-05-31T21:12:16.952Z"}