{"schema_version":"1.0","canonical_url":"https://patentable.app/patents/US-11296001","patent":{"patent_number":"US-11296001","title":"Semiconductor device package and method of manufacturing the same","assignee":null,"inventors":[],"filing_date":"2019-10-03T00:00:00.000Z","publication_date":"2022-04-05T00:00:00.000Z","cpc_codes":["H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L"],"num_claims":20,"abstract":"A package substrate includes a first dielectric layer, a first patterned conductive layer and a first set of alignment marks. The first patterned conductive layer is disposed on the first dielectric layer. The first set of alignment marks is disposed on the first dielectric layer and adjacent to a first edge of the first dielectric layer. The first set of alignment marks includes a plurality of alignment marks. Distances between the alignment marks of the first set of alignment marks and the first edge are different from each other."},"analysis":{"summary":null,"layman_explanation":null,"technical_analysis":null,"business_analysis":null,"faqs":null,"topics":[],"tech_cluster":null},"seo":{"title":"Semiconductor device package and method of manufacturing the same","description":"A package substrate includes a first dielectric layer, a first patterned conductive layer and a first set of alignment marks. The first patterned conductive layer is disposed on the first dielectric l","keywords":[]},"attribution":{"source":"Patentable","source_url":"https://patentable.app","canonical_url":"https://patentable.app/patents/US-11296001","license":"CC-BY-4.0-like","license_terms":"AI-generated analysis on this page (summary, layman_explanation, technical_analysis, business_analysis, faqs) may be reused with attribution and a visible link back to the canonical URL above. Patent abstracts, claims, and bibliographic data are USPTO public domain.","required_link":"https://patentable.app/patents/US-11296001","citation_suggestion":"Patentable. \"Semiconductor device package and method of manufacturing the same\" (US-11296001). https://patentable.app/patents/US-11296001","copyright_holder":"Nomic Interactive Technology LLC"},"links":{"html":"https://patentable.app/patents/US-11296001","json":"https://patentable.app/api/llm-context/US-11296001","site":"https://patentable.app","llms_txt":"https://patentable.app/llms.txt"},"generated_at":"2026-05-30T10:17:56.804Z"}