{"schema_version":"1.0","canonical_url":"https://patentable.app/patents/US-11296004","patent":{"patent_number":"US-11296004","title":"Semiconductor package including heat redistribution layers","assignee":null,"inventors":[],"filing_date":"2019-12-11T00:00:00.000Z","publication_date":"2022-04-05T00:00:00.000Z","cpc_codes":["H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L"],"num_claims":12,"abstract":"A semiconductor package is provided including a first semiconductor package including a first semiconductor chip. The first semiconductor chip includes a first surface and a second surface opposite to the first surface. A second semiconductor package is disposed on the first semiconductor package. The second semiconductor package includes a second redistribution layer including a redistribution line. A second semiconductor chip is disposed on the second redistribution layer. A thermal pillar is disposed on the second redistribution layer. A heat radiator is disposed on the second semiconductor package and connected to the thermal pillar. The redistribution line is connected to the first semiconductor chip."},"analysis":{"summary":null,"layman_explanation":null,"technical_analysis":null,"business_analysis":null,"faqs":null,"topics":[],"tech_cluster":null},"seo":{"title":"Semiconductor package including heat redistribution layers","description":"A semiconductor package is provided including a first semiconductor package including a first semiconductor chip. The first semiconductor chip includes a first surface and a second surface opposite to","keywords":[]},"attribution":{"source":"Patentable","source_url":"https://patentable.app","canonical_url":"https://patentable.app/patents/US-11296004","license":"CC-BY-4.0-like","license_terms":"AI-generated analysis on this page (summary, layman_explanation, technical_analysis, business_analysis, faqs) may be reused with attribution and a visible link back to the canonical URL above. Patent abstracts, claims, and bibliographic data are USPTO public domain.","required_link":"https://patentable.app/patents/US-11296004","citation_suggestion":"Patentable. \"Semiconductor package including heat redistribution layers\" (US-11296004). https://patentable.app/patents/US-11296004","copyright_holder":"Nomic Interactive Technology LLC"},"links":{"html":"https://patentable.app/patents/US-11296004","json":"https://patentable.app/api/llm-context/US-11296004","site":"https://patentable.app","llms_txt":"https://patentable.app/llms.txt"},"generated_at":"2026-05-31T12:26:31.390Z"}