{"schema_version":"1.0","canonical_url":"https://patentable.app/patents/US-11296006","patent":{"patent_number":"US-11296006","title":"Circuit board and packaged chip","assignee":null,"inventors":[],"filing_date":"2019-12-23T00:00:00.000Z","publication_date":"2022-04-05T00:00:00.000Z","cpc_codes":["H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L"],"num_claims":14,"abstract":"A circuit board includes an upper circuit and a lower surface that are opposite to each other, a plurality of heat sink bonding pads, and a plurality of heat sink conductive pads. The heat sink bonding pads are disposed on the upper surface and electrically insulated from one another, and are used to electrically connect to a heat sink. The heat sink conductive pads are disposed on the lower surface, electrically insulated from one another, and electrically connected to the heat sink bonding pads, respectively."},"analysis":{"summary":null,"layman_explanation":null,"technical_analysis":null,"business_analysis":null,"faqs":null,"topics":[],"tech_cluster":null},"seo":{"title":"Circuit board and packaged chip","description":"A circuit board includes an upper circuit and a lower surface that are opposite to each other, a plurality of heat sink bonding pads, and a plurality of heat sink conductive pads. The heat sink bondin","keywords":[]},"attribution":{"source":"Patentable","source_url":"https://patentable.app","canonical_url":"https://patentable.app/patents/US-11296006","license":"CC-BY-4.0-like","license_terms":"AI-generated analysis on this page (summary, layman_explanation, technical_analysis, business_analysis, faqs) may be reused with attribution and a visible link back to the canonical URL above. Patent abstracts, claims, and bibliographic data are USPTO public domain.","required_link":"https://patentable.app/patents/US-11296006","citation_suggestion":"Patentable. \"Circuit board and packaged chip\" (US-11296006). https://patentable.app/patents/US-11296006","copyright_holder":"Nomic Interactive Technology LLC"},"links":{"html":"https://patentable.app/patents/US-11296006","json":"https://patentable.app/api/llm-context/US-11296006","site":"https://patentable.app","llms_txt":"https://patentable.app/llms.txt"},"generated_at":"2026-05-30T15:32:28.982Z"}