{"schema_version":"1.0","canonical_url":"https://patentable.app/patents/US-11296022","patent":{"patent_number":"US-11296022","title":"Package and substrate comprising interconnects with semi-circular planar shape and/or trapezoid planar shape","assignee":null,"inventors":[],"filing_date":"2020-08-25T00:00:00.000Z","publication_date":"2022-04-05T00:00:00.000Z","cpc_codes":["H01L","H01L","H01L","H01L","H01L","H01L","H01L"],"num_claims":29,"abstract":"A substrate that includes at least one dielectric layer, a plurality of first interconnects located in the at least one dielectric layer, at least one photo-imageable dielectric layer coupled to the at least one dielectric layer, and a plurality of second interconnects located in the at least one photo-imageable dielectric layer. The plurality of second interconnects includes at least one pair of adjacent interconnects having a centroid to centroid distance that is less than a pitch between the pair of interconnects. The pair of adjacent interconnects may include a pair of adjacent via interconnects and/or a pair of pad interconnects. The substrate may include a coreless substrate or a cored substrate."},"analysis":{"summary":null,"layman_explanation":null,"technical_analysis":null,"business_analysis":null,"faqs":null,"topics":[],"tech_cluster":null},"seo":{"title":"Package and substrate comprising interconnects with semi-circular planar shape and/or trapezoid planar shape","description":"A substrate that includes at least one dielectric layer, a plurality of first interconnects located in the at least one dielectric layer, at least one photo-imageable dielectric layer coupled to the a","keywords":[]},"attribution":{"source":"Patentable","source_url":"https://patentable.app","canonical_url":"https://patentable.app/patents/US-11296022","license":"CC-BY-4.0-like","license_terms":"AI-generated analysis on this page (summary, layman_explanation, technical_analysis, business_analysis, faqs) may be reused with attribution and a visible link back to the canonical URL above. Patent abstracts, claims, and bibliographic data are USPTO public domain.","required_link":"https://patentable.app/patents/US-11296022","citation_suggestion":"Patentable. \"Package and substrate comprising interconnects with semi-circular planar shape and/or trapezoid planar shape\" (US-11296022). https://patentable.app/patents/US-11296022","copyright_holder":"Nomic Interactive Technology LLC"},"links":{"html":"https://patentable.app/patents/US-11296022","json":"https://patentable.app/api/llm-context/US-11296022","site":"https://patentable.app","llms_txt":"https://patentable.app/llms.txt"},"generated_at":"2026-05-31T18:34:15.190Z"}