{"schema_version":"1.0","canonical_url":"https://patentable.app/patents/US-11296035","patent":{"patent_number":"US-11296035","title":"Semiconductor wafer and semiconductor chip","assignee":null,"inventors":[],"filing_date":"2020-02-20T00:00:00.000Z","publication_date":"2022-04-05T00:00:00.000Z","cpc_codes":["H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L"],"num_claims":20,"abstract":"According to one embodiment, a semiconductor wafer includes a plurality of chip regions, a plurality of chip regions, a device layer, a first structure, and a second structure. The device layer includes an integrated circuit formed in each of the chip regions. The first structure is formed in the kerf region by filling a first cavity with a first filling material. The first cavity extends vertically with respect to a surface of a semiconductor substrate. The second structure is formed in the device layer by filling a second cavity with a second filling material. The second cavity extends vertically with respect to the surface of the semiconductor substrate."},"analysis":{"summary":null,"layman_explanation":null,"technical_analysis":null,"business_analysis":null,"faqs":null,"topics":[],"tech_cluster":null},"seo":{"title":"Semiconductor wafer and semiconductor chip","description":"According to one embodiment, a semiconductor wafer includes a plurality of chip regions, a plurality of chip regions, a device layer, a first structure, and a second structure. The device layer includ","keywords":[]},"attribution":{"source":"Patentable","source_url":"https://patentable.app","canonical_url":"https://patentable.app/patents/US-11296035","license":"CC-BY-4.0-like","license_terms":"AI-generated analysis on this page (summary, layman_explanation, technical_analysis, business_analysis, faqs) may be reused with attribution and a visible link back to the canonical URL above. Patent abstracts, claims, and bibliographic data are USPTO public domain.","required_link":"https://patentable.app/patents/US-11296035","citation_suggestion":"Patentable. \"Semiconductor wafer and semiconductor chip\" (US-11296035). https://patentable.app/patents/US-11296035","copyright_holder":"Nomic Interactive Technology LLC"},"links":{"html":"https://patentable.app/patents/US-11296035","json":"https://patentable.app/api/llm-context/US-11296035","site":"https://patentable.app","llms_txt":"https://patentable.app/llms.txt"},"generated_at":"2026-05-31T10:10:53.491Z"}