{"schema_version":"1.0","canonical_url":"https://patentable.app/patents/US-11296045","patent":{"patent_number":"US-11296045","title":"Semiconductor device and method of manufacturing the same","assignee":null,"inventors":[],"filing_date":"2020-03-26T00:00:00.000Z","publication_date":"2022-04-05T00:00:00.000Z","cpc_codes":["H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L"],"num_claims":18,"abstract":"A semiconductor device is provided and includes first and second semiconductor chips bonded together. The first chip includes a first substrate, a first insulating layer disposed on the first substrate and having a top surface, a first metal pad embedded in the first insulating layer and having a top surface substantially planar with the top surface of the first insulating layer, and a first barrier disposed between the first insulating layer and the first metal pad. The second chip includes a second substrate, a second insulating layer, a second metal pad, and a second barrier with a similar configuration to the first chip. The top surfaces of the first and second insulating layers are bonded to provide a bonding interface, the first and second metal pads are connected, and a portion of the first insulating layer is in contact with a side region of the first metal pad."},"analysis":{"summary":null,"layman_explanation":null,"technical_analysis":null,"business_analysis":null,"faqs":null,"topics":[],"tech_cluster":null},"seo":{"title":"Semiconductor device and method of manufacturing the same","description":"A semiconductor device is provided and includes first and second semiconductor chips bonded together. The first chip includes a first substrate, a first insulating layer disposed on the first substrat","keywords":[]},"attribution":{"source":"Patentable","source_url":"https://patentable.app","canonical_url":"https://patentable.app/patents/US-11296045","license":"CC-BY-4.0-like","license_terms":"AI-generated analysis on this page (summary, layman_explanation, technical_analysis, business_analysis, faqs) may be reused with attribution and a visible link back to the canonical URL above. Patent abstracts, claims, and bibliographic data are USPTO public domain.","required_link":"https://patentable.app/patents/US-11296045","citation_suggestion":"Patentable. \"Semiconductor device and method of manufacturing the same\" (US-11296045). https://patentable.app/patents/US-11296045","copyright_holder":"Nomic Interactive Technology LLC"},"links":{"html":"https://patentable.app/patents/US-11296045","json":"https://patentable.app/api/llm-context/US-11296045","site":"https://patentable.app","llms_txt":"https://patentable.app/llms.txt"},"generated_at":"2026-05-31T13:14:33.385Z"}