{"schema_version":"1.0","canonical_url":"https://patentable.app/patents/US-11296050","patent":{"patent_number":"US-11296050","title":"Chip with magnetic interconnect alignment","assignee":null,"inventors":[],"filing_date":"2017-09-29T00:00:00.000Z","publication_date":"2022-04-05T00:00:00.000Z","cpc_codes":["H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L"],"num_claims":8,"abstract":"An electronic assembly, and a method for making the electronic assembly, includes a first electronic component, a second electronic component, and a plurality of interconnects. The plurality of interconnects electrically couple the first electronic component to the second electronic component. Each of the plurality of interconnects comprise one of a plurality of first magnetic components in physical alignment with an associated one of a plurality of second magnetic components, the plurality of second magnetic components being components of one of the second electronic component and the plurality of interconnects."},"analysis":{"summary":null,"layman_explanation":null,"technical_analysis":null,"business_analysis":null,"faqs":null,"topics":[],"tech_cluster":null},"seo":{"title":"Chip with magnetic interconnect alignment","description":"An electronic assembly, and a method for making the electronic assembly, includes a first electronic component, a second electronic component, and a plurality of interconnects. The plurality of interc","keywords":[]},"attribution":{"source":"Patentable","source_url":"https://patentable.app","canonical_url":"https://patentable.app/patents/US-11296050","license":"CC-BY-4.0-like","license_terms":"AI-generated analysis on this page (summary, layman_explanation, technical_analysis, business_analysis, faqs) may be reused with attribution and a visible link back to the canonical URL above. Patent abstracts, claims, and bibliographic data are USPTO public domain.","required_link":"https://patentable.app/patents/US-11296050","citation_suggestion":"Patentable. \"Chip with magnetic interconnect alignment\" (US-11296050). https://patentable.app/patents/US-11296050","copyright_holder":"Nomic Interactive Technology LLC"},"links":{"html":"https://patentable.app/patents/US-11296050","json":"https://patentable.app/api/llm-context/US-11296050","site":"https://patentable.app","llms_txt":"https://patentable.app/llms.txt"},"generated_at":"2026-05-30T17:07:02.471Z"}