{"schema_version":"1.0","canonical_url":"https://patentable.app/patents/US-11296052","patent":{"patent_number":"US-11296052","title":"TSV-less die stacking using plated pillars/through mold interconnect","assignee":null,"inventors":[],"filing_date":"2017-09-30T00:00:00.000Z","publication_date":"2022-04-05T00:00:00.000Z","cpc_codes":["H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L"],"num_claims":14,"abstract":"A device package has substrates disposed on top of one another to form a stack, and pads formed on at least one of the top surface and the bottom surface of each of the substrates. The device package has interconnects electrically coupling at least one of the top surface and the bottom surface of each substrate to at least one of the top surface and the bottom surface of another substrate. The device package has pillars disposed between at least one of the top surface and the bottom surface of one or more substrates to at least one of the top surface and the bottom surface of other substrates. The device package also has adhesive layers formed between at least one of the top surface and the bottom surface of one or more substrates to at least one of the top surface and the bottom surface of other substrates."},"analysis":{"summary":null,"layman_explanation":null,"technical_analysis":null,"business_analysis":null,"faqs":null,"topics":[],"tech_cluster":null},"seo":{"title":"TSV-less die stacking using plated pillars/through mold interconnect","description":"A device package has substrates disposed on top of one another to form a stack, and pads formed on at least one of the top surface and the bottom surface of each of the substrates. The device package ","keywords":[]},"attribution":{"source":"Patentable","source_url":"https://patentable.app","canonical_url":"https://patentable.app/patents/US-11296052","license":"CC-BY-4.0-like","license_terms":"AI-generated analysis on this page (summary, layman_explanation, technical_analysis, business_analysis, faqs) may be reused with attribution and a visible link back to the canonical URL above. Patent abstracts, claims, and bibliographic data are USPTO public domain.","required_link":"https://patentable.app/patents/US-11296052","citation_suggestion":"Patentable. \"TSV-less die stacking using plated pillars/through mold interconnect\" (US-11296052). https://patentable.app/patents/US-11296052","copyright_holder":"Nomic Interactive Technology LLC"},"links":{"html":"https://patentable.app/patents/US-11296052","json":"https://patentable.app/api/llm-context/US-11296052","site":"https://patentable.app","llms_txt":"https://patentable.app/llms.txt"},"generated_at":"2026-05-31T04:24:12.573Z"}