{"schema_version":"1.0","canonical_url":"https://patentable.app/patents/US-11296706","patent":{"patent_number":"US-11296706","title":"Embedded network on chip accessible to programmable logic fabric of programmable logic device in multi-dimensional die systems","assignee":null,"inventors":[],"filing_date":"2018-06-27T00:00:00.000Z","publication_date":"2022-04-05T00:00:00.000Z","cpc_codes":["G06F","G06F"],"num_claims":24,"abstract":"An integrated circuit device may include programmable logic fabric disposed on a first integrated circuit die, such that the programmable logic fabric may include a first region of programmable logic fabric and a second region of programmable logic fabric. The first region of programmable logic fabric is configured to be programmed with a circuit design that operates on a first set of data. The integrated circuit may also include network on chip (NOC) circuitry disposed on a second integrated circuit die, such that the NOC circuitry is configured to communicate data between the first integrated circuit die and the second integrated circuit die."},"analysis":{"summary":null,"layman_explanation":null,"technical_analysis":null,"business_analysis":null,"faqs":null,"topics":[],"tech_cluster":null},"seo":{"title":"Embedded network on chip accessible to programmable logic fabric of programmable logic device in multi-dimensional die systems","description":"An integrated circuit device may include programmable logic fabric disposed on a first integrated circuit die, such that the programmable logic fabric may include a first region of programmable logic ","keywords":[]},"attribution":{"source":"Patentable","source_url":"https://patentable.app","canonical_url":"https://patentable.app/patents/US-11296706","license":"CC-BY-4.0-like","license_terms":"AI-generated analysis on this page (summary, layman_explanation, technical_analysis, business_analysis, faqs) may be reused with attribution and a visible link back to the canonical URL above. Patent abstracts, claims, and bibliographic data are USPTO public domain.","required_link":"https://patentable.app/patents/US-11296706","citation_suggestion":"Patentable. \"Embedded network on chip accessible to programmable logic fabric of programmable logic device in multi-dimensional die systems\" (US-11296706). https://patentable.app/patents/US-11296706","copyright_holder":"Nomic Interactive Technology LLC"},"links":{"html":"https://patentable.app/patents/US-11296706","json":"https://patentable.app/api/llm-context/US-11296706","site":"https://patentable.app","llms_txt":"https://patentable.app/llms.txt"},"generated_at":"2026-05-30T18:05:29.158Z"}