{"schema_version":"1.0","canonical_url":"https://patentable.app/patents/US-11301104","patent":{"patent_number":"US-11301104","title":"Wiring structure manufacturing method and wiring structure","assignee":null,"inventors":[],"filing_date":"2021-04-26T00:00:00.000Z","publication_date":"2022-04-12T00:00:00.000Z","cpc_codes":["G06F","G06F","G06F","G06F"],"num_claims":6,"abstract":"A wiring structure that includes first wiring parts which are formed of conductive wires and second wiring parts which are formed of thicker conductive wires than the conductive wires of the first wiring parts and are connected to the first wiring parts is formed by offset printing which includes the following processes. First printing process: First conductive ink for forming the first wiring parts is transferred from a first blanket to a base. Second printing process: Second conductive ink for forming the second wiring parts is transferred from a second blanket, which is different from the first blanket, to the base."},"analysis":{"summary":null,"layman_explanation":null,"technical_analysis":null,"business_analysis":null,"faqs":null,"topics":[],"tech_cluster":null},"seo":{"title":"Wiring structure manufacturing method and wiring structure","description":"A wiring structure that includes first wiring parts which are formed of conductive wires and second wiring parts which are formed of thicker conductive wires than the conductive wires of the first wir","keywords":[]},"attribution":{"source":"Patentable","source_url":"https://patentable.app","canonical_url":"https://patentable.app/patents/US-11301104","license":"CC-BY-4.0-like","license_terms":"AI-generated analysis on this page (summary, layman_explanation, technical_analysis, business_analysis, faqs) may be reused with attribution and a visible link back to the canonical URL above. Patent abstracts, claims, and bibliographic data are USPTO public domain.","required_link":"https://patentable.app/patents/US-11301104","citation_suggestion":"Patentable. \"Wiring structure manufacturing method and wiring structure\" (US-11301104). https://patentable.app/patents/US-11301104","copyright_holder":"Nomic Interactive Technology LLC"},"links":{"html":"https://patentable.app/patents/US-11301104","json":"https://patentable.app/api/llm-context/US-11301104","site":"https://patentable.app","llms_txt":"https://patentable.app/llms.txt"},"generated_at":"2026-05-30T09:36:18.449Z"}