{"schema_version":"1.0","canonical_url":"https://patentable.app/patents/US-11302595","patent":{"patent_number":"US-11302595","title":"Package assembly and method for manufacturing the same, package assembly of buck converter","assignee":null,"inventors":[],"filing_date":"2020-09-18T00:00:00.000Z","publication_date":"2022-04-12T00:00:00.000Z","cpc_codes":["H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H02M","H01L","H01L","H01L","H01L","H02M"],"num_claims":19,"abstract":"A package assembly can include: a die electrically connected to outer pins of the package assembly; an electronic component located above the die and electrically connected to the die, wherein the electronic component is connected to the outer pins of the package assembly through conductive pillars; and a heat dissipation structure located between the die and the electronic component to facilitate heat dissipation of the electronic component, where the heat dissipation structure physically isolates the die and the electronic component such that electromagnetic interference from the electronic component to the die is substantially prevented."},"analysis":{"summary":null,"layman_explanation":null,"technical_analysis":null,"business_analysis":null,"faqs":null,"topics":[],"tech_cluster":null},"seo":{"title":"Package assembly and method for manufacturing the same, package assembly of buck converter","description":"A package assembly can include: a die electrically connected to outer pins of the package assembly; an electronic component located above the die and electrically connected to the die, wherein the ele","keywords":[]},"attribution":{"source":"Patentable","source_url":"https://patentable.app","canonical_url":"https://patentable.app/patents/US-11302595","license":"CC-BY-4.0-like","license_terms":"AI-generated analysis on this page (summary, layman_explanation, technical_analysis, business_analysis, faqs) may be reused with attribution and a visible link back to the canonical URL above. Patent abstracts, claims, and bibliographic data are USPTO public domain.","required_link":"https://patentable.app/patents/US-11302595","citation_suggestion":"Patentable. \"Package assembly and method for manufacturing the same, package assembly of buck converter\" (US-11302595). https://patentable.app/patents/US-11302595","copyright_holder":"Nomic Interactive Technology LLC"},"links":{"html":"https://patentable.app/patents/US-11302595","json":"https://patentable.app/api/llm-context/US-11302595","site":"https://patentable.app","llms_txt":"https://patentable.app/llms.txt"},"generated_at":"2026-05-31T09:23:53.174Z"}