{"schema_version":"1.0","canonical_url":"https://patentable.app/patents/US-11302598","patent":{"patent_number":"US-11302598","title":"Semiconductor package","assignee":null,"inventors":[],"filing_date":"2020-09-28T00:00:00.000Z","publication_date":"2022-04-12T00:00:00.000Z","cpc_codes":["H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L"],"num_claims":20,"abstract":"A semiconductor package that effectively controls heat generated from a semiconductor chip is provided. A semiconductor device with improved product reliability and performance is provided. A semiconductor package comprises a substrate including a first surface and a second surface facing each other, a first semiconductor chip and a second semiconductor chip disposed on the first surface of the substrate, a first heat spreader formed on the first semiconductor chip and the second semiconductor chip, and a second heat spreader which protrudes from the first heat spreader and covers an upper part of the first semiconductor chip, wherein the first semiconductor chip includes a first side wall extending in a first direction, the second semiconductor chip includes a second side wall extending in the first direction and facing the first side wall of the first semiconductor chip in a second direction intersecting the first direction, and an area of the second heat spreader at a boundary between the first heat spreader and the second heat spreader is smaller than or equal to an area of an upper surface of the first semiconductor chip."},"analysis":{"summary":null,"layman_explanation":null,"technical_analysis":null,"business_analysis":null,"faqs":null,"topics":[],"tech_cluster":null},"seo":{"title":"Semiconductor package","description":"A semiconductor package that effectively controls heat generated from a semiconductor chip is provided. A semiconductor device with improved product reliability and performance is provided. A semicond","keywords":[]},"attribution":{"source":"Patentable","source_url":"https://patentable.app","canonical_url":"https://patentable.app/patents/US-11302598","license":"CC-BY-4.0-like","license_terms":"AI-generated analysis on this page (summary, layman_explanation, technical_analysis, business_analysis, faqs) may be reused with attribution and a visible link back to the canonical URL above. Patent abstracts, claims, and bibliographic data are USPTO public domain.","required_link":"https://patentable.app/patents/US-11302598","citation_suggestion":"Patentable. \"Semiconductor package\" (US-11302598). https://patentable.app/patents/US-11302598","copyright_holder":"Nomic Interactive Technology LLC"},"links":{"html":"https://patentable.app/patents/US-11302598","json":"https://patentable.app/api/llm-context/US-11302598","site":"https://patentable.app","llms_txt":"https://patentable.app/llms.txt"},"generated_at":"2026-05-30T14:11:28.107Z"}