{"schema_version":"1.0","canonical_url":"https://patentable.app/patents/US-11302637","patent":{"patent_number":"US-11302637","title":"Interconnects including dual-metal vias","assignee":null,"inventors":[],"filing_date":"2020-08-14T00:00:00.000Z","publication_date":"2022-04-12T00:00:00.000Z","cpc_codes":["H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L"],"num_claims":12,"abstract":"An integrated circuit (IC) structure includes a dielectric layer extending along a first axis to define a length and a second axis orthogonal to the first axis to define a width. A dual-metal via is embedded in the dielectric layer. The dual-metal via includes via sidewalls surrounding a via core. An electrically conductive line extends along the first axis and on an upper surface of the dual-metal via. A side portion of the via core is co-planar with a sidewall of the electrically conductive line."},"analysis":{"summary":null,"layman_explanation":null,"technical_analysis":null,"business_analysis":null,"faqs":null,"topics":[],"tech_cluster":null},"seo":{"title":"Interconnects including dual-metal vias","description":"An integrated circuit (IC) structure includes a dielectric layer extending along a first axis to define a length and a second axis orthogonal to the first axis to define a width. A dual-metal via is e","keywords":[]},"attribution":{"source":"Patentable","source_url":"https://patentable.app","canonical_url":"https://patentable.app/patents/US-11302637","license":"CC-BY-4.0-like","license_terms":"AI-generated analysis on this page (summary, layman_explanation, technical_analysis, business_analysis, faqs) may be reused with attribution and a visible link back to the canonical URL above. Patent abstracts, claims, and bibliographic data are USPTO public domain.","required_link":"https://patentable.app/patents/US-11302637","citation_suggestion":"Patentable. \"Interconnects including dual-metal vias\" (US-11302637). https://patentable.app/patents/US-11302637","copyright_holder":"Nomic Interactive Technology LLC"},"links":{"html":"https://patentable.app/patents/US-11302637","json":"https://patentable.app/api/llm-context/US-11302637","site":"https://patentable.app","llms_txt":"https://patentable.app/llms.txt"},"generated_at":"2026-05-31T06:33:39.735Z"}