{"schema_version":"1.0","canonical_url":"https://patentable.app/patents/US-11302644","patent":{"patent_number":"US-11302644","title":"Semiconductor package structure and method for manufacturing the same","assignee":null,"inventors":[],"filing_date":"2019-12-31T00:00:00.000Z","publication_date":"2022-04-12T00:00:00.000Z","cpc_codes":["H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L"],"num_claims":20,"abstract":"A package structure includes a substrate, a first electronic component, a second electronic component, a third electronic component and a connection component. The substrate includes a first surface and a second surface opposite the first surface. The first electronic component is disposed at the substrate and has a first active surface exposed from the second surface of the substrate. The second electronic component includes a second active surface facing the first active surface of the first electronic component. The second active surface of the second electronic component is electrically connected to the first active surface of the first electronic component. The third electronic component includes a third active surface facing the first active face of the first electronic component. The connection component electrically connects the third active surface of the third electronic component to the first active surface of the first electronic component. The connection component has at least two bendings."},"analysis":{"summary":null,"layman_explanation":null,"technical_analysis":null,"business_analysis":null,"faqs":null,"topics":[],"tech_cluster":null},"seo":{"title":"Semiconductor package structure and method for manufacturing the same","description":"A package structure includes a substrate, a first electronic component, a second electronic component, a third electronic component and a connection component. The substrate includes a first surface a","keywords":[]},"attribution":{"source":"Patentable","source_url":"https://patentable.app","canonical_url":"https://patentable.app/patents/US-11302644","license":"CC-BY-4.0-like","license_terms":"AI-generated analysis on this page (summary, layman_explanation, technical_analysis, business_analysis, faqs) may be reused with attribution and a visible link back to the canonical URL above. Patent abstracts, claims, and bibliographic data are USPTO public domain.","required_link":"https://patentable.app/patents/US-11302644","citation_suggestion":"Patentable. \"Semiconductor package structure and method for manufacturing the same\" (US-11302644). https://patentable.app/patents/US-11302644","copyright_holder":"Nomic Interactive Technology LLC"},"links":{"html":"https://patentable.app/patents/US-11302644","json":"https://patentable.app/api/llm-context/US-11302644","site":"https://patentable.app","llms_txt":"https://patentable.app/llms.txt"},"generated_at":"2026-05-30T19:45:07.895Z"}