{"schema_version":"1.0","canonical_url":"https://patentable.app/patents/US-11302645","patent":{"patent_number":"US-11302645","title":"Printed circuit board compensation structure for high bandwidth and high die-count memory stacks","assignee":null,"inventors":[],"filing_date":"2020-06-30T00:00:00.000Z","publication_date":"2022-04-12T00:00:00.000Z","cpc_codes":["H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L"],"num_claims":17,"abstract":"A circuit interconnect for high bandwidth and high die-count memory stacks. The circuit interconnect may include a first ground trace, a first signal trace, a second ground trace, and a second signal trace. The first ground trace may reside in a first layer of a multilayer printed circuit board. The first signal trace may be positioned adjacent to the first ground trace within the first layer. The second ground trace may reside within a second layer of the multilayer printed circuit board. The second signal trace may be positioned adjacent to the second ground trace within the second layer."},"analysis":{"summary":null,"layman_explanation":null,"technical_analysis":null,"business_analysis":null,"faqs":null,"topics":[],"tech_cluster":null},"seo":{"title":"Printed circuit board compensation structure for high bandwidth and high die-count memory stacks","description":"A circuit interconnect for high bandwidth and high die-count memory stacks. The circuit interconnect may include a first ground trace, a first signal trace, a second ground trace, and a second signal ","keywords":[]},"attribution":{"source":"Patentable","source_url":"https://patentable.app","canonical_url":"https://patentable.app/patents/US-11302645","license":"CC-BY-4.0-like","license_terms":"AI-generated analysis on this page (summary, layman_explanation, technical_analysis, business_analysis, faqs) may be reused with attribution and a visible link back to the canonical URL above. Patent abstracts, claims, and bibliographic data are USPTO public domain.","required_link":"https://patentable.app/patents/US-11302645","citation_suggestion":"Patentable. \"Printed circuit board compensation structure for high bandwidth and high die-count memory stacks\" (US-11302645). https://patentable.app/patents/US-11302645","copyright_holder":"Nomic Interactive Technology LLC"},"links":{"html":"https://patentable.app/patents/US-11302645","json":"https://patentable.app/api/llm-context/US-11302645","site":"https://patentable.app","llms_txt":"https://patentable.app/llms.txt"},"generated_at":"2026-05-30T20:33:34.056Z"}