{"schema_version":"1.0","canonical_url":"https://patentable.app/patents/US-11302647","patent":{"patent_number":"US-11302647","title":"Semiconductor device package including conductive layers as shielding and method of manufacturing the same","assignee":null,"inventors":[],"filing_date":"2020-05-14T00:00:00.000Z","publication_date":"2022-04-12T00:00:00.000Z","cpc_codes":["H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L"],"num_claims":18,"abstract":"The present disclosure provides for a semiconductor device package and a method for manufacturing the same. The semiconductor device package includes a substrate, a conductive element and conductive layers. The substrate has a first surface, a second surface opposite to the first surface and a lateral surface extending between the first surface and the second surface. The conductive element is disposed on the first surface of the substrate. The conductive layers have a first portion on the conductive element and a second portion on the lateral surface of the substrate. A number of layers of the first portion of the conductive layers is different from a number of layers of the second portion of the conductive layers."},"analysis":{"summary":null,"layman_explanation":null,"technical_analysis":null,"business_analysis":null,"faqs":null,"topics":[],"tech_cluster":null},"seo":{"title":"Semiconductor device package including conductive layers as shielding and method of manufacturing the same","description":"The present disclosure provides for a semiconductor device package and a method for manufacturing the same. The semiconductor device package includes a substrate, a conductive element and conductive l","keywords":[]},"attribution":{"source":"Patentable","source_url":"https://patentable.app","canonical_url":"https://patentable.app/patents/US-11302647","license":"CC-BY-4.0-like","license_terms":"AI-generated analysis on this page (summary, layman_explanation, technical_analysis, business_analysis, faqs) may be reused with attribution and a visible link back to the canonical URL above. Patent abstracts, claims, and bibliographic data are USPTO public domain.","required_link":"https://patentable.app/patents/US-11302647","citation_suggestion":"Patentable. \"Semiconductor device package including conductive layers as shielding and method of manufacturing the same\" (US-11302647). https://patentable.app/patents/US-11302647","copyright_holder":"Nomic Interactive Technology LLC"},"links":{"html":"https://patentable.app/patents/US-11302647","json":"https://patentable.app/api/llm-context/US-11302647","site":"https://patentable.app","llms_txt":"https://patentable.app/llms.txt"},"generated_at":"2026-05-30T14:29:54.444Z"}