{"schema_version":"1.0","canonical_url":"https://patentable.app/patents/US-11302674","patent":{"patent_number":"US-11302674","title":"Modular stacked silicon package assembly","assignee":null,"inventors":[],"filing_date":"2020-05-21T00:00:00.000Z","publication_date":"2022-04-12T00:00:00.000Z","cpc_codes":["H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L"],"num_claims":20,"abstract":"A chip package assembly and method for fabricating the same are provided that provide a modular chip stack that can be matched with one or more chiplets. The use of chiplets enables the same modular stack to be utilized in a large number of different chip package assembly designs, resulting much faster development times at a fraction of the overall solution cost."},"analysis":{"summary":null,"layman_explanation":null,"technical_analysis":null,"business_analysis":null,"faqs":null,"topics":[],"tech_cluster":null},"seo":{"title":"Modular stacked silicon package assembly","description":"A chip package assembly and method for fabricating the same are provided that provide a modular chip stack that can be matched with one or more chiplets. The use of chiplets enables the same modular s","keywords":[]},"attribution":{"source":"Patentable","source_url":"https://patentable.app","canonical_url":"https://patentable.app/patents/US-11302674","license":"CC-BY-4.0-like","license_terms":"AI-generated analysis on this page (summary, layman_explanation, technical_analysis, business_analysis, faqs) may be reused with attribution and a visible link back to the canonical URL above. Patent abstracts, claims, and bibliographic data are USPTO public domain.","required_link":"https://patentable.app/patents/US-11302674","citation_suggestion":"Patentable. \"Modular stacked silicon package assembly\" (US-11302674). https://patentable.app/patents/US-11302674","copyright_holder":"Nomic Interactive Technology LLC"},"links":{"html":"https://patentable.app/patents/US-11302674","json":"https://patentable.app/api/llm-context/US-11302674","site":"https://patentable.app","llms_txt":"https://patentable.app/llms.txt"},"generated_at":"2026-05-31T14:10:18.979Z"}