{"schema_version":"1.0","canonical_url":"https://patentable.app/patents/US-11302869","patent":{"patent_number":"US-11302869","title":"Manufacturing method of via-hole connection structure, array substrate and manufacturing method thereof, display device and manufacturing method thereof","assignee":null,"inventors":[],"filing_date":"2018-12-26T00:00:00.000Z","publication_date":"2022-04-12T00:00:00.000Z","cpc_codes":["H01L"],"num_claims":18,"abstract":"A manufacturing method of a via-hole connection structure, a manufacturing method of an array substrate and an array substrate are provided by the embodiments of the present disclosure, and the manufacturing method of the via-hole connection structure includes: forming an insulation layer on a base substrate and forming a first via hole in the insulation layer; forming a connection portion in the first via hole; forming a protection layer covering the connection portion on a surface of the insulation layer; forming a second via hole in the insulation layer and in the protection layer; removing at least a portion of the protection layer to expose the connection portion."},"analysis":{"summary":null,"layman_explanation":null,"technical_analysis":null,"business_analysis":null,"faqs":null,"topics":[],"tech_cluster":null},"seo":{"title":"Manufacturing method of via-hole connection structure, array substrate and manufacturing method thereof, display device and manufacturing method thereof","description":"A manufacturing method of a via-hole connection structure, a manufacturing method of an array substrate and an array substrate are provided by the embodiments of the present disclosure, and the manufa","keywords":[]},"attribution":{"source":"Patentable","source_url":"https://patentable.app","canonical_url":"https://patentable.app/patents/US-11302869","license":"CC-BY-4.0-like","license_terms":"AI-generated analysis on this page (summary, layman_explanation, technical_analysis, business_analysis, faqs) may be reused with attribution and a visible link back to the canonical URL above. Patent abstracts, claims, and bibliographic data are USPTO public domain.","required_link":"https://patentable.app/patents/US-11302869","citation_suggestion":"Patentable. \"Manufacturing method of via-hole connection structure, array substrate and manufacturing method thereof, display device and manufacturing method thereof\" (US-11302869). https://patentable.app/patents/US-11302869","copyright_holder":"Nomic Interactive Technology LLC"},"links":{"html":"https://patentable.app/patents/US-11302869","json":"https://patentable.app/api/llm-context/US-11302869","site":"https://patentable.app","llms_txt":"https://patentable.app/llms.txt"},"generated_at":"2026-05-30T10:08:29.154Z"}