{"schema_version":"1.0","canonical_url":"https://patentable.app/patents/US-11304307","patent":{"patent_number":"US-11304307","title":"Printed wiring board and method for manufacturing printed wiring board","assignee":null,"inventors":[],"filing_date":"2020-07-27T00:00:00.000Z","publication_date":"2022-04-12T00:00:00.000Z","cpc_codes":["H01L","H01L"],"num_claims":20,"abstract":"A printed wiring board includes a base insulating layer, a conductor layer formed on the base layer and including first and second pads, a solder resist layer formed on the base layer such that the solder resist layer has first opening exposing the first pad and second opening exposing the second pad with diameter smaller than diameter of the first opening, and bumps including a first bump on the first pad and a second bump on the second pad such that the second bump has diameter smaller than diameter of the first bump. The first bump has a base plating layer formed in the first opening and having raised portion, and a top plating layer formed on the base plating layer, and the second bump has a base plating layer formed in the second opening and having raised portion, and a top plating layer formed on the base plating layer."},"analysis":{"summary":null,"layman_explanation":null,"technical_analysis":null,"business_analysis":null,"faqs":null,"topics":[],"tech_cluster":null},"seo":{"title":"Printed wiring board and method for manufacturing printed wiring board","description":"A printed wiring board includes a base insulating layer, a conductor layer formed on the base layer and including first and second pads, a solder resist layer formed on the base layer such that the so","keywords":[]},"attribution":{"source":"Patentable","source_url":"https://patentable.app","canonical_url":"https://patentable.app/patents/US-11304307","license":"CC-BY-4.0-like","license_terms":"AI-generated analysis on this page (summary, layman_explanation, technical_analysis, business_analysis, faqs) may be reused with attribution and a visible link back to the canonical URL above. Patent abstracts, claims, and bibliographic data are USPTO public domain.","required_link":"https://patentable.app/patents/US-11304307","citation_suggestion":"Patentable. \"Printed wiring board and method for manufacturing printed wiring board\" (US-11304307). https://patentable.app/patents/US-11304307","copyright_holder":"Nomic Interactive Technology LLC"},"links":{"html":"https://patentable.app/patents/US-11304307","json":"https://patentable.app/api/llm-context/US-11304307","site":"https://patentable.app","llms_txt":"https://patentable.app/llms.txt"},"generated_at":"2026-05-30T11:20:28.438Z"}