{"schema_version":"1.0","canonical_url":"https://patentable.app/patents/US-11308257","patent":{"patent_number":"US-11308257","title":"Stacked via rivets in chip hotspots","assignee":null,"inventors":[],"filing_date":"2020-12-15T00:00:00.000Z","publication_date":"2022-04-19T00:00:00.000Z","cpc_codes":["G06F","H01L","G06F","H01L","H01L","G06F"],"num_claims":17,"abstract":"A structure including a plurality of dielectric regions is described. The structure can include a rivet cell. The rivet cell can include a set of stacked vias. The rivet cell can extend through a stress hotspot of the structure. A length of the rivet cell can thread through at least one dielectric region among the plurality of dielectric regions. The rivet cell can be among a number of rivet cells inserted in the stress hotspot. The stress hotspot can be among a plurality of stress hotspots across the structure. A length of the rivet cell can be based on a model of a relationship between the length of the rivet cell and an energy release rate of the structure. The rivet cell can thread through an interface between a first dielectric region and a second dielectric region having different dielectric constants."},"analysis":{"summary":null,"layman_explanation":null,"technical_analysis":null,"business_analysis":null,"faqs":null,"topics":[],"tech_cluster":null},"seo":{"title":"Stacked via rivets in chip hotspots","description":"A structure including a plurality of dielectric regions is described. The structure can include a rivet cell. The rivet cell can include a set of stacked vias. The rivet cell can extend through a stre","keywords":[]},"attribution":{"source":"Patentable","source_url":"https://patentable.app","canonical_url":"https://patentable.app/patents/US-11308257","license":"CC-BY-4.0-like","license_terms":"AI-generated analysis on this page (summary, layman_explanation, technical_analysis, business_analysis, faqs) may be reused with attribution and a visible link back to the canonical URL above. Patent abstracts, claims, and bibliographic data are USPTO public domain.","required_link":"https://patentable.app/patents/US-11308257","citation_suggestion":"Patentable. \"Stacked via rivets in chip hotspots\" (US-11308257). https://patentable.app/patents/US-11308257","copyright_holder":"Nomic Interactive Technology LLC"},"links":{"html":"https://patentable.app/patents/US-11308257","json":"https://patentable.app/api/llm-context/US-11308257","site":"https://patentable.app","llms_txt":"https://patentable.app/llms.txt"},"generated_at":"2026-05-30T17:06:14.103Z"}