{"schema_version":"1.0","canonical_url":"https://patentable.app/patents/US-11462446","patent":{"patent_number":"US-11462446","title":"Power semiconductor module arrangement and method for producing the same","assignee":null,"inventors":[],"filing_date":"2020-05-05T00:00:00.000Z","publication_date":"2022-10-04T00:00:00.000Z","cpc_codes":["H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L"],"num_claims":17,"abstract":"A power semiconductor module arrangement includes a semiconductor substrate arranged in a housing, at least one semiconductor body being arranged on the semiconductor substrate, and a mounting arrangement including a frame or body, a first terminal element, and a second terminal element. The mounting arrangement is inserted in and coupled to the housing. Each terminal element mechanically and electrically contacts the semiconductor substrate with a first end. A middle part of each terminal element extends through the frame or body. A second end of each terminal element extends outside the housing. The first terminal element is dielectrically insulated from the second terminal element by a portion of the frame or body. The first terminal element is injected into and inextricably coupled to the frame or body. The second terminal element is arranged within a hollow space inside the frame or body and is detachably coupled to the frame or body."},"analysis":{"summary":null,"layman_explanation":null,"technical_analysis":null,"business_analysis":null,"faqs":null,"topics":[],"tech_cluster":null},"seo":{"title":"Power semiconductor module arrangement and method for producing the same","description":"A power semiconductor module arrangement includes a semiconductor substrate arranged in a housing, at least one semiconductor body being arranged on the semiconductor substrate, and a mounting arrange","keywords":[]},"attribution":{"source":"Patentable","source_url":"https://patentable.app","canonical_url":"https://patentable.app/patents/US-11462446","license":"CC-BY-4.0-like","license_terms":"AI-generated analysis on this page (summary, layman_explanation, technical_analysis, business_analysis, faqs) may be reused with attribution and a visible link back to the canonical URL above. Patent abstracts, claims, and bibliographic data are USPTO public domain.","required_link":"https://patentable.app/patents/US-11462446","citation_suggestion":"Patentable. \"Power semiconductor module arrangement and method for producing the same\" (US-11462446). https://patentable.app/patents/US-11462446","copyright_holder":"Nomic Interactive Technology LLC"},"links":{"html":"https://patentable.app/patents/US-11462446","json":"https://patentable.app/api/llm-context/US-11462446","site":"https://patentable.app","llms_txt":"https://patentable.app/llms.txt"},"generated_at":"2026-05-31T16:56:57.030Z"}