{"schema_version":"1.0","canonical_url":"https://patentable.app/patents/US-11462453","patent":{"patent_number":"US-11462453","title":"Semiconductor device with protection layers and method for fabricating the same","assignee":null,"inventors":[],"filing_date":"2020-07-10T00:00:00.000Z","publication_date":"2022-10-04T00:00:00.000Z","cpc_codes":["H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L"],"num_claims":13,"abstract":"The present application discloses a semiconductor device with protection layers for reducing the metal to silicon leakage and a method for fabricating the semiconductor device. The semiconductor device includes a first die, a first conductive feature positioned in the first die, a second die positioned on the first die, a first mask layer positioned on the second die, a conductive filler layer positioned along the first mask layer and the second die, extending to the first die, and contacting the first conductive feature, isolation layers positioned between the conductive filler layer and the first die and between the conductive filler layer and the second die, and protection layers positioned between the conductive filler layer and the first mask layer and covering upper portions of the isolation layers."},"analysis":{"summary":null,"layman_explanation":null,"technical_analysis":null,"business_analysis":null,"faqs":null,"topics":[],"tech_cluster":null},"seo":{"title":"Semiconductor device with protection layers and method for fabricating the same","description":"The present application discloses a semiconductor device with protection layers for reducing the metal to silicon leakage and a method for fabricating the semiconductor device. The semiconductor devic","keywords":[]},"attribution":{"source":"Patentable","source_url":"https://patentable.app","canonical_url":"https://patentable.app/patents/US-11462453","license":"CC-BY-4.0-like","license_terms":"AI-generated analysis on this page (summary, layman_explanation, technical_analysis, business_analysis, faqs) may be reused with attribution and a visible link back to the canonical URL above. Patent abstracts, claims, and bibliographic data are USPTO public domain.","required_link":"https://patentable.app/patents/US-11462453","citation_suggestion":"Patentable. \"Semiconductor device with protection layers and method for fabricating the same\" (US-11462453). https://patentable.app/patents/US-11462453","copyright_holder":"Nomic Interactive Technology LLC"},"links":{"html":"https://patentable.app/patents/US-11462453","json":"https://patentable.app/api/llm-context/US-11462453","site":"https://patentable.app","llms_txt":"https://patentable.app/llms.txt"},"generated_at":"2026-05-30T11:16:47.921Z"}