{"schema_version":"1.0","canonical_url":"https://patentable.app/patents/US-11462460","patent":{"patent_number":"US-11462460","title":"Electrical module assembly with embedded dies","assignee":null,"inventors":[],"filing_date":"2019-06-06T00:00:00.000Z","publication_date":"2022-10-04T00:00:00.000Z","cpc_codes":["H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L"],"num_claims":19,"abstract":"An electrical module assembly is provided. The electrical module assembly includes a circuit board with a first circuit-board surface and a second circuit-board surface defining a cavity, and an antenna disposed on the first circuit-board surface. The electrical module assembly also includes a wafer-level packaged (WLP) die embedded in the cavity. The WLP die has a first WLP die surface and a second WLP die surface. The second WLP die surface has electrical contacts thereon. The circuit board includes vias that extend from the antenna through the circuit board to the first WLP die surface to interconnect the antenna and the WLP die. The electrical module assembly further includes a second circuit board coupled to the second circuit-board surface, and coupled to the WLP die at the electrical contacts on the second WLP die surface of the WLP die."},"analysis":{"summary":null,"layman_explanation":null,"technical_analysis":null,"business_analysis":null,"faqs":null,"topics":[],"tech_cluster":null},"seo":{"title":"Electrical module assembly with embedded dies","description":"An electrical module assembly is provided. The electrical module assembly includes a circuit board with a first circuit-board surface and a second circuit-board surface defining a cavity, and an anten","keywords":[]},"attribution":{"source":"Patentable","source_url":"https://patentable.app","canonical_url":"https://patentable.app/patents/US-11462460","license":"CC-BY-4.0-like","license_terms":"AI-generated analysis on this page (summary, layman_explanation, technical_analysis, business_analysis, faqs) may be reused with attribution and a visible link back to the canonical URL above. Patent abstracts, claims, and bibliographic data are USPTO public domain.","required_link":"https://patentable.app/patents/US-11462460","citation_suggestion":"Patentable. \"Electrical module assembly with embedded dies\" (US-11462460). https://patentable.app/patents/US-11462460","copyright_holder":"Nomic Interactive Technology LLC"},"links":{"html":"https://patentable.app/patents/US-11462460","json":"https://patentable.app/api/llm-context/US-11462460","site":"https://patentable.app","llms_txt":"https://patentable.app/llms.txt"},"generated_at":"2026-05-30T20:33:59.674Z"}