{"schema_version":"1.0","canonical_url":"https://patentable.app/patents/US-11462462","patent":{"patent_number":"US-11462462","title":"Semiconductor packages including a recessed conductive post","assignee":null,"inventors":[],"filing_date":"2020-02-11T00:00:00.000Z","publication_date":"2022-10-04T00:00:00.000Z","cpc_codes":["H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L"],"num_claims":19,"abstract":"Semiconductor packages may include a semiconductor chip including a chip pad and a lower redistribution that includes a lower redistribution insulating layer and a lower redistribution pattern. The lower redistribution insulating layer may include a top surface facing the semiconductor chip. The semiconductor packages may also include a molding layer on a side of the semiconductor chip and including a bottom surface facing the lower redistribution structure and a conductive post in the molding layer. The conductive post may include a bottom surface contacting the lower redistribution. The top surface of the lower redistribution insulating layer may be closer to a top surface of the conductive post than a top surface of the molding layer. A roughness of the top surface of the molding layer may be greater than a roughness of the top surface of the conductive post."},"analysis":{"summary":null,"layman_explanation":null,"technical_analysis":null,"business_analysis":null,"faqs":null,"topics":[],"tech_cluster":null},"seo":{"title":"Semiconductor packages including a recessed conductive post","description":"Semiconductor packages may include a semiconductor chip including a chip pad and a lower redistribution that includes a lower redistribution insulating layer and a lower redistribution pattern. The lo","keywords":[]},"attribution":{"source":"Patentable","source_url":"https://patentable.app","canonical_url":"https://patentable.app/patents/US-11462462","license":"CC-BY-4.0-like","license_terms":"AI-generated analysis on this page (summary, layman_explanation, technical_analysis, business_analysis, faqs) may be reused with attribution and a visible link back to the canonical URL above. Patent abstracts, claims, and bibliographic data are USPTO public domain.","required_link":"https://patentable.app/patents/US-11462462","citation_suggestion":"Patentable. \"Semiconductor packages including a recessed conductive post\" (US-11462462). https://patentable.app/patents/US-11462462","copyright_holder":"Nomic Interactive Technology LLC"},"links":{"html":"https://patentable.app/patents/US-11462462","json":"https://patentable.app/api/llm-context/US-11462462","site":"https://patentable.app","llms_txt":"https://patentable.app/llms.txt"},"generated_at":"2026-05-31T12:25:05.856Z"}