{"schema_version":"1.0","canonical_url":"https://patentable.app/patents/US-11462464","patent":{"patent_number":"US-11462464","title":"Fan-out semiconductor package having redistribution line structure","assignee":null,"inventors":[],"filing_date":"2020-12-03T00:00:00.000Z","publication_date":"2022-10-04T00:00:00.000Z","cpc_codes":["H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L"],"num_claims":20,"abstract":"A fan-out semiconductor package including a redistribution line structure is provided. The fan-out semiconductor package includes a plurality of redistribution line insulating layers and a plurality of redistribution line patterns arranged on at least one of an upper surface and a lower surface of each of the plurality of redistribution line insulating layers; at least one semiconductor chip arranged on the redistribution line structure and occupying a footprint having a horizontal width that is less than a horizontal width of the redistribution line structure; and a molding member surrounding the at least one semiconductor chip on the redistribution line structure and having a horizontal width that is greater than the horizontal width of the redistribution line structure, wherein the plurality of redistribution line insulating layers have a cascade structure."},"analysis":{"summary":null,"layman_explanation":null,"technical_analysis":null,"business_analysis":null,"faqs":null,"topics":[],"tech_cluster":null},"seo":{"title":"Fan-out semiconductor package having redistribution line structure","description":"A fan-out semiconductor package including a redistribution line structure is provided. The fan-out semiconductor package includes a plurality of redistribution line insulating layers and a plurality o","keywords":[]},"attribution":{"source":"Patentable","source_url":"https://patentable.app","canonical_url":"https://patentable.app/patents/US-11462464","license":"CC-BY-4.0-like","license_terms":"AI-generated analysis on this page (summary, layman_explanation, technical_analysis, business_analysis, faqs) may be reused with attribution and a visible link back to the canonical URL above. Patent abstracts, claims, and bibliographic data are USPTO public domain.","required_link":"https://patentable.app/patents/US-11462464","citation_suggestion":"Patentable. \"Fan-out semiconductor package having redistribution line structure\" (US-11462464). https://patentable.app/patents/US-11462464","copyright_holder":"Nomic Interactive Technology LLC"},"links":{"html":"https://patentable.app/patents/US-11462464","json":"https://patentable.app/api/llm-context/US-11462464","site":"https://patentable.app","llms_txt":"https://patentable.app/llms.txt"},"generated_at":"2026-05-30T17:18:38.734Z"}