{"schema_version":"1.0","canonical_url":"https://patentable.app/patents/US-11462480","patent":{"patent_number":"US-11462480","title":"Microelectronic assemblies having interposers","assignee":null,"inventors":[],"filing_date":"2018-06-27T00:00:00.000Z","publication_date":"2022-10-04T00:00:00.000Z","cpc_codes":["H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L"],"num_claims":25,"abstract":"Microelectronic assemblies, and related devices and methods, are disclosed herein. For example, in some embodiments, a microelectronic assembly may include a package substrate having a high bandwidth interconnect, a first interposer having high bandwidth circuitry coupled to the package substrate, wherein the high bandwidth circuitry of the first interposer is electrically coupled to the high bandwidth interconnect, and a second interposer having high bandwidth circuitry coupled to the package substrate, wherein the high bandwidth circuitry of the second interposer is electrically coupled to the high bandwidth interconnect, and wherein the first interposer is electrically coupled to the second interposer via the high bandwidth interconnect."},"analysis":{"summary":null,"layman_explanation":null,"technical_analysis":null,"business_analysis":null,"faqs":null,"topics":[],"tech_cluster":null},"seo":{"title":"Microelectronic assemblies having interposers","description":"Microelectronic assemblies, and related devices and methods, are disclosed herein. For example, in some embodiments, a microelectronic assembly may include a package substrate having a high bandwidth ","keywords":[]},"attribution":{"source":"Patentable","source_url":"https://patentable.app","canonical_url":"https://patentable.app/patents/US-11462480","license":"CC-BY-4.0-like","license_terms":"AI-generated analysis on this page (summary, layman_explanation, technical_analysis, business_analysis, faqs) may be reused with attribution and a visible link back to the canonical URL above. Patent abstracts, claims, and bibliographic data are USPTO public domain.","required_link":"https://patentable.app/patents/US-11462480","citation_suggestion":"Patentable. \"Microelectronic assemblies having interposers\" (US-11462480). https://patentable.app/patents/US-11462480","copyright_holder":"Nomic Interactive Technology LLC"},"links":{"html":"https://patentable.app/patents/US-11462480","json":"https://patentable.app/api/llm-context/US-11462480","site":"https://patentable.app","llms_txt":"https://patentable.app/llms.txt"},"generated_at":"2026-05-31T00:37:34.802Z"}