{"schema_version":"1.0","canonical_url":"https://patentable.app/patents/US-11462484","patent":{"patent_number":"US-11462484","title":"Electronic package with wettable flank and shielding layer and manufacturing method thereof","assignee":null,"inventors":[],"filing_date":"2020-10-08T00:00:00.000Z","publication_date":"2022-10-04T00:00:00.000Z","cpc_codes":["H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L"],"num_claims":13,"abstract":"An electronic package and manufacturing method thereof are provided. The electronic package includes a substrate, a first encapsulant, a wettable flank and a shielding layer. The substrate includes a first surface, a second surface opposite to the first surface and a side surface connecting the first surface and the second surface. The first encapsulant is disposed on the first surface of the substrate. The wettable flank is exposed from the side surface of the substrate. The shielding layer covers a side surface of the first encapsulant, wherein on the side surface of the substrate, the shielding layer is spaced apart from the wettable flank."},"analysis":{"summary":null,"layman_explanation":null,"technical_analysis":null,"business_analysis":null,"faqs":null,"topics":[],"tech_cluster":null},"seo":{"title":"Electronic package with wettable flank and shielding layer and manufacturing method thereof","description":"An electronic package and manufacturing method thereof are provided. The electronic package includes a substrate, a first encapsulant, a wettable flank and a shielding layer. The substrate includes a ","keywords":[]},"attribution":{"source":"Patentable","source_url":"https://patentable.app","canonical_url":"https://patentable.app/patents/US-11462484","license":"CC-BY-4.0-like","license_terms":"AI-generated analysis on this page (summary, layman_explanation, technical_analysis, business_analysis, faqs) may be reused with attribution and a visible link back to the canonical URL above. Patent abstracts, claims, and bibliographic data are USPTO public domain.","required_link":"https://patentable.app/patents/US-11462484","citation_suggestion":"Patentable. \"Electronic package with wettable flank and shielding layer and manufacturing method thereof\" (US-11462484). https://patentable.app/patents/US-11462484","copyright_holder":"Nomic Interactive Technology LLC"},"links":{"html":"https://patentable.app/patents/US-11462484","json":"https://patentable.app/api/llm-context/US-11462484","site":"https://patentable.app","llms_txt":"https://patentable.app/llms.txt"},"generated_at":"2026-05-31T07:01:07.917Z"}